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All Journal Indonesian Journal of Electrical Engineering and Computer Science
Glenn N. Ortiz
Technological University of the Philippines Taguig

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Journal : Indonesian Journal of Electrical Engineering and Computer Science

 1 
Mitigating board endorsement through re-spinning with surface-mounted device under test pad Ber-Riel Malimban; Glenn N. Ortiz; Mark Joseph B. Enojas
Indonesian Journal of Electrical Engineering and Computer Science Vol 26, No 1: April 2022
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v26.i1.pp75-85

Abstract

The two-part legacy board device under test (DUT) pad has been very useful for testing of microelectronic packages. However, this board has been subjected to many repair endorsements due to open connection of DUT pad and cut traces of the board components as recorded. Board re-spin is used to improve the performance of the test boards in microelectronic packages production. It improves the board development to create more functional printed circuit boards for testing and introduces the use of modern tools and software applied to the schematic creation up to the production board debugging. This paper presents a method of creating test boards for the development and manufacturing of microelectronic packages and integrated circuits. The two-part board is converted into a single board interface which eliminates the open DUT connections. A surface-mounted DUT pad is introduced to replace the old hypertact pins which are included in the re-spin board for a more robust performance. The schematic creation and board debugging were done to lessen problems caused by connection faults. In result, producing re-spin boards mitigates board endorsement which in return increases the manufacturing output performance. A faster and convenient setup was achieved when the old two-board setup was eliminated.
14-bit ADC as voltage monitoring device for power supply module 6 using I2C interface Edison R. Castillo; Catherine D. Samson; Glenn N. Ortiz; Mark Joseph B. Enojas
Indonesian Journal of Electrical Engineering and Computer Science Vol 23, No 2: August 2021
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v23.i2.pp709-716

Abstract

Thereare recorded downtime in the current testing processes of microelectronic packages. The available test equipment, the isolation of the power supply modules and the processes of testing must be changed in order to minimize the downtime. This study presents the design and development of a voltage monitoring device made of a 14-bit analog to digital converter (ADC) interfaced through inter-integrated circuit (I2C) for power supply module 6 (PS6). It is built to address the downtime in isolation and testing process of PS6. This setup is able to monitor and display three output voltages operating in 4-12V signals through athin film transistor (TFT) monitor. Tests were conducted for the nominal voltage and current setting scalled the three-point tests. In result, the fault detection and calibration process of PS6 are able to minimize downtimes. The developed voltage monitoring device has an acceptable percentage of 0.04572% which also canbe a replacement for digital multimeters (DMMs) for specific applications to PS6.
Automated data monitoring of MEMS cleanroom parametric requirements Jean M. Capanang; Jobelle P. Panganiban; Glenn N. Ortiz; Mark Joseph B. Enojas
Indonesian Journal of Electrical Engineering and Computer Science Vol 23, No 2: August 2021
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v23.i2.pp701-708

Abstract

Cleanroom parameters such as temperature, relative humidity and particle count are vital in maintaining cleanliness. People and machines working inside the cleanroom are main contributors for the sudden changes of the separameters. Measurements and monitoring of these parameters are therefore necessary to reduce rejects and downtime in the production of micro-electro-mechanical systems (MEMS). This paper presents a method of developmentof an automated data monitoring of MEMS cleanroom parametric requirements. The prototype developed uses DHT11 sensor and Sharp dust sensor for measuring the temperature, humidity and particle count respectively which are displayed in an LCD display. These parameters are recorded through a data logger for analysis and control. Additionally, agraphical user interface was also developed using visual studio for the working personnel and for supervisory monitoring and control. As a result, the possible quality compromise in the production of MEMS is detected when the monitored parameters are beyond the range.
Single board re-spin for testing bridge transducer products Frances D. de la Rama; Marwin L. Tocama; Glenn N. Ortiz; Mark Joseph B. Enojas
Indonesian Journal of Electrical Engineering and Computer Science Vol 28, No 1: October 2022
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v28.i1.pp88-97

Abstract

Integrated circuit (IC) testing involves equipment and product interface board setup. Complex interfaces and obsolete components are some of the factors affecting the board functionality which results in manufacturing downtime. The legacy boards must be simplified so that it needs advanced tools for the lay-out and designing of test boards. This study proposes a solution for board functionality issues by re-spinning the legacy two-board interface into a single board interface. It converts the standard use of boards and standard contacting to single board interface (SBI) and plunge-to-board (PTB) contacting. As a result, the setup time is improved, minimizing board and system repair due to mismatch and contact issues. The board endorsement for contact issues were trimmed from 82 to 46 counts. Other board related issues are decreased by 60% based on the analysis of the correlation in the processes. Additionally, mismatches, which are system issues, are lessened which promotes fixtures maintainability.
Co-Authors Ber-Riel Malimban Catherine D. Samson Edison R. Castillo Frances D. de la Rama Jean M. Capanang Jobelle P. Panganiban Mark Joseph B. Enojas Marwin L. Tocama