International Journal of Electrical and Computer Engineering
Vol 9, No 1: February 2019

Bin packing algorithms for virtual machine placement in cloud computing: a review

Kumaraswamy S (Global Academy of Technology)
Mydhili K Nair (Ramaiah Institiue of Technology)



Article Info

Publish Date
01 Feb 2019

Abstract

Cloud computing has become more commercial and familiar. The Cloud data centers havhuge challenges to maintain QoS and keep the Cloud performance high. The placing of virtual machines among physical machines in Cloud is significant in optimizing Cloud performance. Bin packing based algorithms are most used concept to achieve virtual machine placement(VMP). This paper presents a rigorous survey and comparisons of the bin packing based VMP methods for the Cloud computing environment. Various methods are discussed and the VM placement factors in each methods are analyzed to understand the advantages and drawbacks of each method. The scope of future research and studies are also highlighted.

Copyrights © 2019






Journal Info

Abbrev

IJECE

Publisher

Subject

Computer Science & IT Electrical & Electronics Engineering

Description

International Journal of Electrical and Computer Engineering (IJECE, ISSN: 2088-8708, a SCOPUS indexed Journal, SNIP: 1.001; SJR: 0.296; CiteScore: 0.99; SJR & CiteScore Q2 on both of the Electrical & Electronics Engineering, and Computer Science) is the official publication of the Institute of ...