Jurnal Ilmiah Informatika Komputer
Vol 13, No 3 (2008)

THE STUDY HOW TO ASSEMBLING SMD DEVICE INTEGRATED

Wibowo, Kunto (Unknown)

Article Info

Publish Date
18 Nov 2009

Abstract

Nowadays, the size of electronic components is not macro anymore, but already in micro size, even nano. In designing electronic device using surface mount device (SMD), a number of special components which has better characteristics is oftentimes required because of the demand which can not be tolerated. Hermetic SMD (airproof SMD) is a preference to fulfill the demand for design of small size, light weight, perfect thermal performance, free of switching waves, and also higher circuit efficiency.Keyword(s): assembling, SMD, thermal performance, effcient.Subject Description : B.7.Integrated Circuit | B.7.1. Types and Design Styles | Advanced Technologies

Copyrights © 2008




Citation Download
RIS
EndNote, Reference Manager, ProCite
BibTex
Latex, Jabref
Original Source
Download Original
Google Scholar
Check in Google Scholar
Journal Info
Jurnal Ilmiah Informatika Komputer
Website

Abbrev

infokom

Publisher

Universitas Gunadarma

Subject

Computer Science & IT Decision Sciences, Operations Research & Management

Description

This journal is published periodically three times a year, April, August, and December. It publishes a broad range of research articles on Information Technology and Communication, whether in Indonesian Language or ...