TELKOMNIKA (Telecommunication Computing Electronics and Control)
Vol 17, No 4: August 2019

Breakdown characteristics of polyethylene/silicon nitride nanocomposites

A. Azmi (Universiti Teknologi Malaysia)
K. A. A. Seman (Universiti Teknologi Malaysia)
K. Y. Lau (Universiti Teknologi Malaysia)



Article Info

Publish Date
01 Aug 2019

Abstract

Silicon nitride (Si3N4) has been utilized as a nanofiller in polymeric insulation due to its good characteristics in both electrical insulation and thermal conduction properties. In this work, a comparative study was performed between unfilled polyethylene and polyethylene containing different amounts of Si3N4 nanofiller. The study showed that the low density polyethylene (LDPE) added with 15 wt% of Si3N4nanofiller could have higher breakdown strength compared to equivalent LDPE with 10 wt% of Si3N4nanofiller. Morphological characterizations of the nanocomposite samples were performed using field emission electron microscopy (FESEM) and the results showed that the breakdown performance of the investigated materials were affected by the agglomeration of Si3N4 nanoparticles.

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Journal Info

Abbrev

TELKOMNIKA

Publisher

Subject

Computer Science & IT

Description

Submitted papers are evaluated by anonymous referees by single blind peer review for contribution, originality, relevance, and presentation. The Editor shall inform you of the results of the review as soon as possible, hopefully in 10 weeks. Please notice that because of the great number of ...