TELKOMNIKA (Telecommunication Computing Electronics and Control)
Vol 18, No 1: February 2020

Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate

Linh Ta Phuong (Ministry of Science and Technology)
Bernard Journet (LPQM (CNRS UMR-8537) École normale supérieure Paris-Saclay, CentraleSupelec, Université Paris-Saclay, France)
Duong Bach Gia (VNU University of Engineering and Technology)



Article Info

Publish Date
01 Feb 2019

Abstract

The low noise amplifier (LNA) plays an important role in many communication systems, especially at the receiver’s front-ends. In modern RF designs, The LNA is usually fabricated on a microstrip printed circuit board (PCB) due to its simplicity and ability of integrating flexibly with other components in a receiving circuitry unit. At frequencies lower than 6 GHz, the most prevalent substrate material for a microstrip LNA is FR-4 while at higher frequencies of over 10 GHz, it is challenging to design the LNA using this material without causing considerable losses to the RF signal. There are many works related to design microstrip LNA at high frequencies, however, the dielectric substrates used in most of them were high-cost materials for low dielectric loss. This paper introduces an LNA topology using the common, low-cost FR-4 substrate which can be operated in Ku-band for applications such as small satellites’ receivers, with the expected noise figure of lower than 1 dB, gain of around 10 dB and the return loss of around -10 dB. The stepped impedance matching technique has been used for transmission line optimization. The simulated and measured results are presented.

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Journal Info

Abbrev

TELKOMNIKA

Publisher

Subject

Computer Science & IT

Description

Submitted papers are evaluated by anonymous referees by single blind peer review for contribution, originality, relevance, and presentation. The Editor shall inform you of the results of the review as soon as possible, hopefully in 10 weeks. Please notice that because of the great number of ...