TELKOMNIKA (Telecommunication Computing Electronics and Control)
Vol 10, No 3: September 2012

A Miniaturized In Situ Tensile Platform under Microscope

Zhichao Ma Zhichao Ma (Jilin University)
Hongwei Zhao (Jilin University)
Hu Huang Hu Huang (Jilin University)
Kaiting Wang (Jilin University)
Qinchao Li Qinchao Li (Jilin University)
Xiaoqin Zhou (Jilin University)
Xiaoli Hu Xiaoli Hu (Jilin University)



Article Info

Publish Date
01 Sep 2012

Abstract

Aiming at the mechanical testing of three-dimensional specimens with feature size of centimeter level, a miniaturized tensile platform, which presents compatibility with scanning electron microscope (SEM) and metallographic microscope, was designed and built. The platform could accurately evaluate the parameters such as elastic modulus, elongation and yield limit, etc. The calibration experiments of load sensor and displacement sensor showed the two kinds of sensors had high linearity. Testing of transmission error and modal parameters showed that the platform presented good following behaviors and separation of resonance region. Comparison tests based on stress-strain curve were carried out between the self-made platform and the commercial tensile instrument (Instron) to verify the feasibility of the platform. Furthermore, the in situ tensile experiment under metallographic microscope was carried out on a kind of manganese steel.

Copyrights © 2012






Journal Info

Abbrev

TELKOMNIKA

Publisher

Subject

Computer Science & IT

Description

Submitted papers are evaluated by anonymous referees by single blind peer review for contribution, originality, relevance, and presentation. The Editor shall inform you of the results of the review as soon as possible, hopefully in 10 weeks. Please notice that because of the great number of ...