<![CDATA[Sengon (Paraserianthes falcataria (L) Nielsen), is a fast-growing tree species that widely planted inIndonesia. However, some of the wood properties such as low-density, low-hardness, and low-strength limits itsutilization. A study was conducted to evaluate the effect of thermal compregnation on the physical as well asmechanical properties of Sengon boards. The tangential board (36 cm x12 cm x3 cm) were impregnated bychitosan solution 0,5% under different temperature levels (100°C, 120°C, and 140°C), then thermallycompressed to be 1,5 cm thickness under different temperature levels (150°C, 170°C, and 190°C). Moisturecontent, density, hardness, springback, Modulus of Elasticity, and Modulus of Rupture of the experimentalboards were evaluated. Microscopic feature of the boards were also evaluated using Scanning ElectronMicroscope (SEM).The results showed that thermal compregnation positively affected the density, hardness,MOE as well as MOR of the boards. Density of compregnated boards had increased 80.70% compared withuncompregnated boards.In addition, hardness of compregnated boards (286,91 kg/cm²) were increased 54.61%compared with uncompregnated board (159,20 kg/cm²). Thermal compregnation was also increase MOE andMOR of Sengon boards as much as 53.20% and 52.77%, respectively. Meanwhile springback of compregnatedboards were significant decrease by chitosan impregnation.The optimum temperature for impregnation as wellas compression process of the boards were 100°C and 150°C respectively.Keywords: chitosan, compregnation, density, mechanical strength, sengon]]>
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