IPTEK Journal of Proceedings Series
No 5 (2019): The 1st International Conference on Business and Management of Technology (IConBMT)

Rubber Strap Quality Improvement by Optimization of Tensile Strength and Time Curing Using Response Surface Methodology

Erwanto, Jefri (Department of Industrial Management, Institut Teknologi Sepuluh Nopember)
Su’ef, Mok. (Department of Industrial Management, Institut Teknologi Sepuluh Nopember)



Article Info

Publish Date
25 Dec 2019

Abstract

This paper will demonstrate combination of optimum response for Tensile strength and Time curing which are obtained by combining elastomer, filler and co-accelerator at optimum level factors is the best way to overcome defect products. Data from this study will be obtained from 15 direct experiments based on RSM by using box-behnken design-Minitab 18 and response optimization was performed to get optimal response value combination from the expected target response. The analysis shows that all factors including elastomer, filler and co-accelerator have significant effect on tensile strength and time curing responses. The best composition to get the optimal combination of responses from certain response limits is elastomer = 70PHR, filler = 30PHR, and co-accelerator = 1.47PHR. The optimum value for tensile strength response is 15 kg/cm2 and time curing is 3.5 minutes. Beside as a solution for this problem, this optimization will increase production capacity of rubber strap 12.5% more that the factory decide to decrease production line and choose market development strategy to overcome access production and labor to new product base on polyurethane

Copyrights © 2019






Journal Info

Abbrev

jps

Publisher

Subject

Computer Science & IT

Description

IPTEK Journal of Proceedings Series publishes is a journal that contains research work presented in conferences organized by Institut Teknologi Sepuluh Nopember. ISSN: 2354-6026. The First publication in 2013 year from all of full paper in International Conference on Aplied Technology, Science, and ...