SAINSTECH: Jurnal Penelitian dan Pengkajian Sains dan Teknologi
Vol 33 No 3 (2023): Sainstech: Jurnal Penelitian dan Pengkajian Sains dan Teknologi

Analisis Impregnasi Nanopartikel Tembaga (Cu) Pada Non Woven Polypropylene

Musfirah Cahya F.T (Unknown)



Article Info

Publish Date
17 Oct 2023

Abstract

Abstract To determine the density with copper nanoparticles and the addition of mass of polypropylene non-woven fabric and the characteristics of the crystal structure of the formed copper nanoparticles. Synthetic copper nanoparticles using substances which is precursor of copper from copper sulfate pentahydrate (CuSO4.5H2O), ascorbate acid (C6H8O6) as an antioxidant, and reductor solution using sodium borohydrate (NaBH4). The ex-situ formation of copper nanoparticles was then impregnated on non-woven polypropylene through an immersion process with different variations of time. Based on characterization of X-ray Diffraction (XRD), Fourier Transform Infrared (FTIR), and Scanning Electron Microscope (SEM), formed copper nanoparticles characterized of face centered cubic with high increasing of crystalinity at [1, 1, 1] with average size is 65 nm and the wavelength showed at the peak of 730 cm-1 and 710 cm-1 identified as copper nanoparticles. The addition of the highest density in the sample is 5.37%.. Keywords: Copper, Crystal Structure ,Density, Nanoparticle.

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Journal Info

Abbrev

sainstech

Publisher

Subject

Biochemistry, Genetics & Molecular Biology Civil Engineering, Building, Construction & Architecture Electrical & Electronics Engineering Engineering Mechanical Engineering

Description

SAINSTECH adalah jurnal ilmiah multidisiplin diterbitkan oleh Institut Sains dan Teknologi nasional Jakarta yang dikelola oleh Lembaga Penelitian dan Pengabdian pada Masyarakat Sainstech menerbitkan artikel yang berasal dari internal Institut dan menerima naskah secara Nasional. Bidang yang ...