<![CDATA[Wheat flour packaging currently only uses flexible packaging of plastic materials that are inconvenient, such as being difficult to open and close, and the product's contents becoming messy. Based on this, improvements and developments are needed in wheat flour packaging. This study aims to determine the design concept and packaging elements and make a mockup of wheat flour packaging. The methods used in this study are the Kansei engineering method, Principal Component Analysis (PCA) to get design concepts, QTT1 to get design elements, and fuzzy logic for evaluation of packaging design mockups. The results are 40 packaging samples, 51 Kansei words describing the product, 3PC or 3 concepts consisting of Varied - Exclusive, Innovative - Useable, and Flexible - Reusable. The prioritized concept is PC3, based on the most considerable R-squared value of 0.9465. The seven recommended PC3 design elements consist of Rigid Plastic (X1.6), Jar (X2.2), Unfeatured (X3.1), Lug cap (X4.3), Traditional (X5.4), Direct Print (X6.2), and Illustration (X7.2).]]>
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