International Journal of Reconfigurable and Embedded Systems (IJRES)
Vol 14, No 3: November 2025

Chirp-pulsed eddy current testing for crack detection in low-carbon steel

Le, Dang-Khanh (Unknown)
Phuong Hoang, Sy (Unknown)
Minh Le, Duc (Unknown)
Huy Pham, Phuong (Unknown)
Hieu Trieu, Trung (Unknown)
Le, Minhhuy (Unknown)



Article Info

Publish Date
01 Nov 2025

Abstract

This paper introduces a signal processing feature for chirp-pulsed eddy current testing (C-PECT) to improve crack detection in low-carbon steel, a common material in maritime structures. While C-PECT is an established technique, inspecting ferromagnetic materials is challenging due to significant background noise from lift-off variations and material permeability. The novelty of this work lies in the proposal of a frequency-domain integration feature designed to suppress this noise. The method utilizes a chirp-pulse-excited probe with a Hall sensor to measure the magnetic field response. By integrating the signal's magnitude spectrum, the frequency feature effectively flattens the background and enhances the signal-to-noise ratio. Experimental validation on a low-carbon steel specimen with artificial cracks demonstrates the feature's superior performance in providing clear, high-contrast crack indications compared to a conventional time-domain analysis. The results indicate that this approach offers a simple, computationally efficient, and robust solution for the qualitative detection and localization of cracks, enhancing structural integrity assessments in noisy industrial environments.

Copyrights © 2025






Journal Info

Abbrev

IJRES

Publisher

Subject

Economics, Econometrics & Finance

Description

The centre of gravity of the computer industry is now moving from personal computing into embedded computing with the advent of VLSI system level integration and reconfigurable core in system-on-chip (SoC). Reconfigurable and Embedded systems are increasingly becoming a key technological component ...