<![CDATA[Food spoilage is accompanied by changes in environmental parameters, including temperature, carbon dioxide (CO₂) concentration, and relative humidity, which can influence the electrical response of metal oxide semiconductor sensors. This study aimed to fabricate an SnO₂ resistive sensor by electroplating and evaluate its electrical response to environmental variations during food spoilage. The SnO₂ sensing layer was deposited on a Cu substrate by electroplating at 6.0 V and an electrolyte temperature of 40 °C, followed by thermal oxidation. The fabricated sensor was tested in a sealed chamber containing a food sample undergoing natural spoilage, while temperature, CO₂ concentration, relative humidity, and sensor resistance were simultaneously monitored. The results showed that the sensor resistance generally decreased with increasing temperature, CO₂ concentration, and relative humidity. Regression analysis revealed a strong relationship between sensor resistance and temperature (R² = 0.8729), whereas relative humidity showed a moderate relationship (R² = 0.5669). The resistance response to CO₂ concentration also exhibited a distinct nonlinear trend associated with the progression of food decomposition. These findings indicate that temperature and CO₂ concentration exert a stronger influence on the electrical response of the electroplated SnO₂ sensor than relative humidity. The fabricated sensor therefore demonstrates potential as a low-cost resistive sensing platform for monitoring environmental changes associated with food spoilage. ]]>
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