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INDONESIA
Indonesian Journal of Electrical Engineering and Computer Science
Published by Institute of Advanced Engineering and Science
ISSN : 25024752     EISSN : 25024760     DOI : -
Core Subject :
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Articles 24 Documents
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Search results for , issue "Vol 16, No 2: November 2015" : 24 Documents clear
Range-Free Localization Schemes for Wireless Sensor Networks R. Khadim; M. Erritali; A. Maaden
Indonesian Journal of Electrical Engineering and Computer Science Vol 16, No 2: November 2015
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v16.i2.pp323-332

Abstract

Localization of nodes is one of the key issues of wireless sensor network (WSN) that gained a wide attention in recent years. The existing localization techniques can be generally categorized into two types: range-based and range-free. Compared with rang-based schemes, the range-free schemes are more cost-effective, because no additional ranging devices are needed. As a result, we focus our research on the range-free schemes. In this paper we study three types of range-free location algorithms to compare the localization error and energy consumption of each one. Centroid algorithm requires a normal node has at least three neighbor anchors, while DV-hop algorithm doesn’t have this requirement. The third studied algorithm is the amorphous algorithm similar to DV-Hop algorithm, and the idea is to calculate the hop distance between two nodes instead of the linear distance between them .The simulation results show that the localization accuracy of the amorphous algorithm is higher than that of other algorithms and the energy consumption does not increase too much.
Research on the Glass Silicon Anodic Direct Bonding Parameters Jia Li; Guo Hao; Guo Zhiping; Miao Shujing
Indonesian Journal of Electrical Engineering and Computer Science Vol 16, No 2: November 2015
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v16.i2.pp291-295

Abstract

By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test silicon specifications experimental study.Firstly,according to the anodic bonding principle,the main factors to detemine the effect of bonding quality.Secodly,change the bonding temperature,bonding time,and test wafer size and other parameters,glass silicon bonding contrast test.Finally,the calculation and analysis of comparative test of each group is bonded porosity,summanrized the factors that affect the quality of the bonding and bonding to achieve the best results in the bonding conditions.Experimental results indicate that when the bonding voltage of 1200V,bonding temperature of 445-455c,bonding time is 60s,the void fractin is less than 5%.Glass and Silicon wafer bonding quality can achieve the best. The experimental results in order to improve the glass silicon bonding quaity provides the basis.
Performance Analysis of Various Phases of SRM with Classical and New Compact Converter S.M. Mohamed Saleem; L. Senthil Murugan
Indonesian Journal of Electrical Engineering and Computer Science Vol 16, No 2: November 2015
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v16.i2.pp256-264

Abstract

In recent years, considerable attention has been given to find the compact and low cost power converter topology for Switched Reluctance Motor (SRM) drive to meet the emerging applications such as plotters, fans, pumps, screw rotary compressor drives, high speed application drives above 30,000 RPM. This paper is concerned with such as attempt to formulate a new compact power converter for SRM drive. The proposed power converter has reduced number of power electronic components which makes the converter compact and also reduce the switching losses. The power factor plays a vital issue in the usage of power electronic converters. The power boost converter and PI controller. A Simulink system is developed for 3Φ SRM by using MATLAB software. The proposed converter performance is compared with the classical converter and analysis results are presented.
Prediction of Poor Inhabitant Number Using Least Square and Moving Average Method Ningrum Ekawati
Indonesian Journal of Electrical Engineering and Computer Science Vol 16, No 2: November 2015
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v16.i2.pp369-376

Abstract

Poor population in South Kalimantan recently shows a decreased number for the last three years, compared to few previous years. The number of poor population differs from time to time. This dynamical scaled number has actually been a problem for South Kalimantan local government to take proper policies to solve this matter.  It will then be necessary to predict potential number of poor population in the next year as the basis of subsequent policy making. This research will apply both Least Square and Moving Average methods as measurement to count prediction values. From the result, we can say that prediction analysis using those two methods is valid for predicting acquired number of potential people population based on its previous data due to its closest result to the actual condition. Reviewing the test result of last three years, the applied least square method shows validity of 92, 8%. Meanwhile, the applied moving average method shows validity of 98,8% both are considered valid.

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