Ali Jebreen
Palestine Ahliya University

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Yield, Weight Loss, and Frying Time of Jackfruit and Papaya Chips Produced by Vacuum Frying Hanifah Dwi Zaharani; Safinta Nurindra Rahmadhia; Ali Jebreen; Swapnil Prashant Gautam
Indonesian Journal of Applied Science and Engineering Vol. 3 No. 2 (2025)
Publisher : Peneliti Teknologi Teknik Indonesia

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.59247/ijase.v3i2.162

Abstract

Jackfruit and papaya are highly perishable fruits that require appropriate processing to extend shelf life and increase their economic value. Vacuum frying is commonly used to produce fruit chips with reduced moisture content while preserving product quality. This study contributes to evaluated the yield, weight loss, and frying time of jackfruit and papaya chips produced under commercial vacuum-frying conditions. Data were collected through direct observation and production records from 11 processing batches (n = 11). The process was conducted at a frying temperature of 85°C and a vacuum pressure of −65 cmHg. No process parameters were intentionally varied; therefore, the study represents the performance of a single operating condition. The average yield of jackfruit and papaya chips was 23.3% and 11.6% respectively while the respective weight losses were 76.7% and 88.4%. The average frying times were 119 min for jackfruit chips and 129 min for papaya chips. The lower yield, higher weight loss and longer frying time observed in papaya chips indicates a higher moisture removal requirement than jackfruit chips. These findings provide baseline performance data for vacuum-fried fruit chip production and suggest that differences in raw material characteristics, particularly moisture content, strongly influence processing efficiency and product recovery.
Packaging Quality Control in a Small-Scale Tempeh Industry Using Pareto Analysis and Control Charts Ardhiansyah Pradana; Safinta Nurindra Rahmadhia; Ainul Mardhiah; Ali Jebreen
Indonesian Journal of Applied Science and Engineering Vol. 4 No. 2 (2026)
Publisher : Peneliti Teknologi Teknik Indonesia

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.59247/ijase.v4i2.165

Abstract

Tempeh is a traditional Indonesian fermented food with high economic value and is widely consumed by the public. In the tempeh industry, packaging quality is a crucial factor as it protects the product during fermentation, storage, and distribution. Packaging defects such as torn packaging or loose seals can reduce product quality and increase the risk of contamination. This study aims to analyze the level of packaging defects and evaluate the stability of the tempeh packaging process using a Statistical Quality Control (SQC) approach. The study was conducted at a tempeh industry in Yogyakarta using observation data for seven days of production. The analysis was conducted using check sheets, Pareto diagrams, and c-charts. The results showed that during the observation period, 179 packaging defects were found out of a total production of 3,670 kg. The 700 g packaging size had the highest number of defects at 71 defects (39.7%), followed by the 425 g packaging with 64 defects (35.8%), while the 150 g and 270 g packaging each contributed 14.5% and 10.0% of the total defects, respectively. Pareto analysis showed that 700g and 425g packaging contributed 75.5% to the total defects, making them a top priority in the quality improvement program. The c-chart analysis showed a CL value of 25.57, a UCL of 40.74, and a LCL of 10.40. All observation points were within the control limits, indicating that the packaging process was in statistically controlled conditions. However, the relatively high number of defects indicated the need for continuous improvement efforts, especially in large-sized packaging. This study demonstrated that the application of the SQC method can be used effectively to identify quality improvement priorities and evaluate the stability of the packaging process in small and medium-scale tempeh industries.