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All Journal Sinergi Jurnal Teknologi Elektro InComTech: Jurnal Telekomunikasi dan Komputer Indonesian Journal of Electrical Engineering and Computer Science Journal of Telecommunication, Electronics and Control Engineering (JTECE) Journal of Integrated and Advanced Engineering (JIAE)
Umaisaroh Umaisaroh
Universitas Mercu Buana
Civil Engineering, Building, Construction & Architecture Computer Science & IT Control & Systems Engineering Electrical & Electronics Engineering Engineering Industrial & Manufacturing Engineering Mechanical Engineering

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Journal : InComTech: Jurnal Telekomunikasi dan Komputer

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Front Matter Vol 12 No 2 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 12, No 2 (2022)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v12i2.16741

Abstract

Back Matter Vol 12 No 2 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 12, No 2 (2022)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v12i2.16742

Abstract

Front Matter Vol 12 No 3 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 12, No 3 (2022)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v12i3.18456

Abstract

Back Matter Vol 12 No 3 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 12, No 3 (2022)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v12i3.18457

Abstract

Back Matter Vol 12 No 3
Front Matter Vol 13 No 1 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 13, No 1 (2023)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v13i1.20237

Abstract

Front Matter Vol 13 No 2 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 13, No 2 (2023)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v13i2.22417

Abstract

Back Matter Vol 13 No 2 Umaisaroh Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 13, No 2 (2023)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v13i2.22418

Abstract

Performances of SMD Components on FR4 Substrates at Higher Frequencies Veronica, Veronica; Umaisaroh, Umaisaroh; Alaydrus, Mudrik
InComTech : Jurnal Telekomunikasi dan Komputer Vol 14, No 3 (2024)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v14i3.29982

Abstract

The advances of many technological wireless systems lead to development of several important microwave circuit components as supporting parts. The last century was the eye-witness of the development of many microwave components implemented on distributed, lumped elements or combination of them.  In the design stage, we must fulfill the specified targets in terms of S-parameters over certain desired frequency intervals. The observation of several surface mounted devices installed in a microstrip structure is an important verification of the characteristics of the components especially at higher frequencies. We use the software ANSYS Electromagnetic Suite and AWR Design Environment as analytical tools. We verify the results by building the structures and measuring the reflection and transmission coefficient. The microstrip structure is modeled in a 1.4mm thick FR-4 substrate, with a dimension 50 mm x 50 mm is backed by a metallic copper ground with a thickness of 0.035 mm. We fabricated the structure under observation and did some measurement to verify its performances using a vector network analyzer. The computer programs give almost the same results for all cases except for the surface mounted device inductance. In this way we can rely on the computational modeling. The reflection and transmission coefficient of a 1.4mm thick microstrip line were verified by measurement with a very good similarity up to 5 GHz. The comparison of the simulated and measured reflection and transmission coefficient for resistor is almost the same for up to around 5 GHz, whereas for capacitor for up to around 6 GHz and for inductor for up to around 7 GHz.
Front Matter vol 14 no 3 Umaisaroh, Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 14, No 3 (2024)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v14i3.31436

Abstract

Front Matter
Back Matter Vol 14 No 1 Umaisaroh, Umaisaroh
InComTech : Jurnal Telekomunikasi dan Komputer Vol 14, No 1 (2024)
Publisher : Department of Electrical Engineering

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/incomtech.v14i1.27062

Abstract

Back Matter Vol 14 No 1
Co-Authors A Majid, Huda Ahmad Firdausi Dian Widi Astuti, Budi Irawan Prima Putra, Dian Widi Astuti, Firhan Fathurahman Galang Persada Nur Hakim Lusi Damayanti Makarim, Fakhri Zaki Mudrik Alaydrus Muslim Muslim Nurafifah Sirait Rizki Nugraha Hidayat Said Attamimi Syah Alam VERONICA VERONICA