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All Journal International Journal of Electrical and Computer Engineering ComEngApp : Computer Engineering and Applications Journal Proceeding of the Electrical Engineering Computer Science and Informatics

Lelyzar Siregar

Fakultas Ilmu Komputer Dan Teknologi Informasi, Universitas Sumatera Utara, Medan

Author-ID : 2378762

Computer Science & IT Electrical & Electronics Engineering Engineering

Published : 3 Documents Claim Missing Document

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Articles

SeamSAR: Seamless, Secure And Robust Handover Model for Mobile IPTV Network Using Enhanced FMIPv6 Ismat Aldmour; Thair Al-Dala’in; Lelyzar Siregar; Rahmat Budiarto
International Journal of Electrical and Computer Engineering (IJECE) Vol 5, No 2: April 2015
Publisher : Institute of Advanced Engineering and Science

Multimedia becomes one of the most wanted content in the modern Internet world. Since the Mobile Internet Protocol version 6 (MIPv6) was proposed, many researchers have tried to develop a new protocol based on this technology in order to improve the performance of mobile multimedia services. The world is emerging toward the Mobile Internet Protocol Television (MIPTV) era where people are enabled to watch television while roaming. The MIPTV technology requires high bandwidth and low latency handover. This paper proposes a new model of secure and robust handover with low handover latency, called SeamSAR. The model introduces a new way to perform home binding update and correspondent binding update simultaneously. Simulation results show that the proposed model reduced the handover latency to 63% compared to FMIPv6. Moreover, the secureness of the proposed model was verified using CMurphi simulator.

Network-on-Chip Paradigm for System-on-Chip Communication Rahmat Budiarto; Lelyzar Siregar; Deris Stiawan
Computer Engineering and Applications Journal Vol 6 No 1 (2017)
Publisher : Universitas Sriwijaya

Developments of modern technologies in electronics, such as communication, Internet, pervasive and ubiquitous computing and ambient intelligence have figured largely our life. In our day micro-electronic products inspire the ways of learning, communication and entertainment. These products such as laptop computer, mobile phones, and personal handheld sets are becoming faster, lighter in weight, smaller in size, larger in capacity, lower in power consumptions, cheaper and functionally enhanced. This trend will persistently continue. Following this trend, we could integrate more and more complex applications and even systems onto a single chip. The System-on-Chip (SoC) technologies, where complex applications are integrated onto single ULSI chips became key driving force for the developments.

Enhancement of FMIPv6 by Utilising Concurent Binding Update Process Ismat Aldmour; Lelyzar Siregar; Thair Al Dala’in; Rahmat Budiarto
Proceeding of the Electrical Engineering Computer Science and Informatics Vol 1: EECSI 2014
Publisher : IAES Indonesia Section

The world is progressing toward the Mobile Internet Protocol Television (MIPTV) era where people are able to watch television while roaming. The MIPTV technology requires high bandwidth and low latency handover. This paper enhances the binding updates process in the Fast Handover Mobile IPv6 (FMIPv6) to improve its handover process performance in term of secureness and robustness, by implementing concurant binding update process thru the use of the International Mobile Subscriber Identifier (IMSI). Simulation results show that the proposed idea reduces the handover latency to about 63% compared to standard FMIPv6.

Co-Authors Deris Stiawan Ismat Aldmour Ismat Aldmour Rahmat Budiarto Rahmat Budiarto Thair Al Dala’in Thair Al-Dala’in Yundari, Yundari

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