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All Journal International Journal of Electrical and Computer Engineering TELKOMNIKA (Telecommunication Computing Electronics and Control) Indonesian Journal of Electrical Engineering and Computer Science
Masrullizam Mat Ibrahim
Universiti Teknikal Malaysia Melaka (UTeM)
Computer Science & IT Electrical & Electronics Engineering

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An enhanced lossless compression with cryptography hybrid mechanism for ECG biomedical signal monitoring Mustafa Hameed; Masrullizam Mat Ibrahim; Nurulfajar Abd Manap; Ali A. Mohammed
International Journal of Electrical and Computer Engineering (IJECE) Vol 10, No 3: June 2020
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (645.109 KB) | DOI: 10.11591/ijece.v10i3.pp3235-3243

Abstract

Due to their use in daily life situation, demand for remote health applications and e-health monitoring equipment is growing quickly. In this phase, for fast diagnosis and therapy, information can be transferred from the patient to the distant clinic. Nowadays, the most chronic disease is cardiovascular diseases (CVDs). However, the storage and transmission of the ECG signal, consumes more energy, bandwidth and data security which is faced many challenges. Hence, in this work, we present a combined approach for ECG data compression and cryptography. The compression is performed using adaptive Huffman encoding and encrypting is done using AES (CBC) scheme with a 256-bit key. To increase the security, we include Diffie-Hellman Key exchange to authenticate the receiver, RSA key generation for encrypting and decrypting the data. Experimental results show that the proposed approach achieves better performance in terms of compression and encryption on MIT-BIH ECG dataset.
Compression and encryption for ECG biomedical signal in healthcare system Mustafa Emad Hameed; Masrullizam Mat Ibrahim; Nurulfajar Abd Manap
TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 17, No 6: December 2019
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/telkomnika.v17i6.13240

Abstract

The ECG data needs large memory storage device due to continuous heart rate logs and vital parameter storage. Thus, efficient compression schemes are applied to it before sending it to the telemedicine center for monitoring and analysis. Proper compression mechanisms can not only improve the storage efficiency but also help in faster porting of data from one device to another due to its compact size. Also, the collected ECG signals are processed through various filtering techniques to remove unnecessary noise and then compressed. In our scheme, we propose use of buffer blocks, which is quite novel in this field. Usage of highly efficient methods for peak detection, noise removal, compression and encryption enable seamless and secure transmission of ECG signal from sensor to the monitor. This work further makes use of AES 256 CBC mode, which is barely used in embedded devices, proves to be very strong and efficient in ciphering of the information. The PRD outcome of proposed work comes as 0.41% and CR as 0.35%, which is quite better than existing schemes. Experimental results prove the efficiency of proposed schemes on five distinct signal records from MIT-BIH arrhythmia datasets.
Assessment of detection methods for back-end process defects in equipment and devices in semiconductor manufacturing Ameer Farhan Roslan; Masrullizam Mat Ibrahim; Nik Mohd Zarifie Hashim; Mohd Syahrin Amri Mohd Noh; Tole Sutikno
Indonesian Journal of Electrical Engineering and Computer Science Vol 41, No 2: February 2026
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v41.i2.pp494-503

Abstract

Defect detection plays a pivotal part in the manufacturing process of semiconductors. Defects can be rooted in the product on its own, as well as the tools used to process and make the product, particularly the equipment and machinery used. Defect detection is crucial in semiconductor manufacturing, where even minor flaws can compromise product performance. Defect detection in the backend process of semiconductor manufacturing, specifically in die attach and die bonding, is critical for ensuring product quality and reliability. Die attach involves securing semiconductor chips onto substrates, while die bonding involves connecting wires to the chip. Detecting defects during these processes is vital to prevent issues such as misalignment, inadequate bonding, or contamination, which can lead to malfunctioning chips or devices. Various techniques such as visual inspection, automated optical inspection (AOI), and X-ray imaging are utilized to identify defects like cracks, voids, or irregularities in bond formation. By employing rigorous defect detection measures, manufacturers can uphold stringent quality standards and produce reliable semiconductor devices for various applications.
Co-Authors Ali A. Mohammed Ameer Farhan Roslan Mohd Syahrin Amri Mohd Noh Mustafa Emad Hameed Mustafa Hameed Nik Mohd Zarifie Hashim Nurulfajar Abd Manap Nurulfajar Abd Manap Tole Sutikno