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All Journal International Journal of Power Electronics and Drive Systems (IJPEDS) Indonesian Journal of Electrical Engineering and Computer Science
Irni Hamiza Hamzah
Universiti Teknologi MARA
Control & Systems Engineering Electrical & Electronics Engineering

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Development and analysis of VAWT offgrid in ducting system Irni Hamiza Hamzah; M. H. Roslan; A. A. Malik; N. W. M. Saad; A. F. A. Rahim
International Journal of Power Electronics and Drive Systems (IJPEDS) Vol 11, No 3: September 2020
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (549.271 KB) | DOI: 10.11591/ijpeds.v11.i3.pp1298-1304

Abstract

Horizontal Axis Wind Turbine (HAWT) had been widely used in Malaysia, however, research concluded that the power produced is still low which approximately 0.02% from the wind turbine input is. The average wind speed in Penang, Malaysia, is recorded between 1.0 m/s to 2.5 m/s whereby to produce 2.7 kW of power by HAWT, 12.0 m/s of average wind speed is needed. Therefore, the main objective in this project is to develop and analyse the suitability on the Vertical Axis Wind Turbine (VAWT) to be used for power generation with the wind speed in between 0.5 m/s to 3.0 m/s. Ducting system is chosen rather than the open air since commercial buildings used Heat Ventilation Air Conditioning (HVAC) system. Arduino microcontroller and LabVIEW is used as interfaced to setup two types of sensors that is temperature sensor and anemometer.
Cyclic voltammetry characterization analysis on the cu/flame retardant 4 fabricated biosensor Irni Hamiza Hamzah; Azman Ab Malik; Aida Zulia Zulhanip; Zainal Hisham Che Soh; Alhan Farhanah Abd Rahim
Indonesian Journal of Electrical Engineering and Computer Science Vol 18, No 3: June 2020
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v18.i3.pp1199-1206

Abstract

Silicon, glass and ceramic are commonly base substrate used in DNA biosensor fabrication due to its biocompatible, expensive, hard and brittle. However due to the difficulty for drilling and dicing, these materials required expensive equipments and complex methodology of fabrication. Large gap of thermal expansion coefficient (TEC) between silicon/glass and film caused microcracks. Hence, the aim of this work is to investigate the suitability and the application of a non-biocompatible material, flame retardant 4 (FR4) as a base substrate for a label free DNA biosensor. Cyclic voltammetry (CV) reversible method has been implemented to test the fabricated Cu/Au on the FR4. It is found that the fabrication of Au has been made possible by the used of oxide-free Cu as an adhesion layer on the FR4 substrate. The area size of counter electrode (CE), working electrode (WE) and reference electrode (RE) are found to be 6.25 mm2, 0.581 mm2 and 1.04 mm2, respectively, in order to achieve the unity reversible redox relationship and to ensure the sensor’s reliability for 10 mM K3Fe(CN)6 solution in 0.1 M KCl. Thus it can be concluded that the proposed FR4-based substrate fulfilled the CV reversible process characterization.
Co-Authors A. A. Malik A. F. A. Rahim Aida Zulia Zulhanip Alhan Farhanah Abd Rahim Azman Ab Malik M. H. Roslan N. W. M. Saad Zainal Hisham Che Soh