Article Per Year (5 Year)
p-Index From 2020 - 2025
0
P-Index
This Author published in this journals
All Journal International Journal of Reconfigurable and Embedded Systems (IJRES)
L. Manivannan
Knowledge Institute of Technology
Economics, Econometrics & Finance

Published : 2 Documents Claim Missing Document
Claim Missing Document
Check
Articles

Found 2 Documents
Search

 1 
GSM Based Generator Monitoring System for Steel Melting Shop S. Boopathi; M. Jagadeeshraja; L. Manivannan
International Journal of Reconfigurable and Embedded Systems (IJRES) Vol 5, No 1: March 2016
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (525.164 KB) | DOI: 10.11591/ijres.v5.i1.pp42-48

Abstract

Steel making processes are highly energy intensive and comprised of many complex unit operations. Iron ore and coal need preprocessing before feeding into a reactor, and molten metal from different reactors needs to be carefully drawn into a solid metal and then rolled into sheets. Each of these operations has a stake in the quality of steel produced, and needs constant monitoring and need continuous power supply for fabrication. If a power failure occurs the production will be stopped, time delay increases for finishing fabrication. In some cases we can loss consumer due to unsatisfactory. My Project focuses the detection of power failure and takes reflex action to solve the problem with help of modem communication using GSM. The power failure will be intimated to the Microcontroller it drive the GSM modem to send a text message to the concern person mobile number which was already programmed in Microcontroller and also monitoring the parameter are temperature, oil level, fuel level and when they exceed predefined limits an automatically intimated to authorized person and also This system can be designed to send SMS alerts whenever the Circuit Breaker (Relay) trips and simulation result done by using LabVIEW software.
An Automated Way of Baking Process for Moisture Sensitive Components A. Ramamoorthy; M. Jagadeeshraja; L. Manivannan; K. Raja
International Journal of Reconfigurable and Embedded Systems (IJRES) Vol 5, No 1: March 2016
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (665.222 KB) | DOI: 10.11591/ijres.v5.i1.pp1-7

Abstract

The objective of my project is to the new technology termed as “baking process” to remove the moisture content available in the particular electronics devices which is used in Rea time industrial application. In Industries there are certain policies are maintained for semiconductor devices, which referred as “Shelf life” of the material. Once it crossed its lifetime, some process need to done to extend this. Depends on the moisture sensitive characteristics baking is employed mainly to shelf life extension. The Baking is the process of removing of moisture content from particular semiconductor device in order to effective usage in the production line.  In my propose method the moisture content is measured by corresponding moisture sensor. If it is normal level the processor goes to the normal state, If it is reaches the abnormal level (presence of moisture) the processor baked the product. Temperature and humidity sensors are effectively monitor and provide the signal to the processor. The UTLP kit provide the information about the status of the product.
Co-Authors A. Ramamoorthy K. Raja M. Jagadeeshraja S. Boopathi