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All Journal TELKOMNIKA (Telecommunication Computing Electronics and Control)
Nur Warissyahidah Badrul Hisham
Universiti Teknologi Malaysia
Computer Science & IT

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Thermal Performance Analysis for Optimal Passive Cooling Heat Sink Design Nur Warissyahidah Badrul Hisham; Fatimah Sham Ismail; Muhammad Azmi Ahmed Nawawi
TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 15, No 2: June 2017
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/telkomnika.v15i2.6140

Abstract

Recent advances in semiconductor technology show the improvement of fabrication on electronics appliances in terms of performance, power density and even the size. This great achievement however led to some major problems on thermal and heat distribution of the electronic devices. This thermal problem could reduce the efficiency and reliability of the electronic devices. In order to minimize this thermal problem, an optimal cooling techniques need to be applied during the operation. There are various cooling techniques have been used and one of them is passive pin fin heat sink approach. This paper focuses on inline pin fin heat sink, which use copper material with different shapes of pin fin and a constant 5.5W heat sources. The simulation model has been formulated using COMSOL Multiphysics software to stimulate the pin fin design, study the thermal distribution and the maximum heat profile.
Co-Authors Fatimah Sham Ismail Muhammad Azmi Ahmed Nawawi