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Nurul Kausar Ab Majid
Universiti Teknologi Malaysia
Computer Science & IT

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Electronics system thermal management optimization using finite element and Nelder-Mead method Nurul Kausar Ab Majid; Fatimah Sham Ismail
TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 17, No 5: October 2019
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/telkomnika.v17i5.12796

Abstract

The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system.  This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system.
Co-Authors Fatimah Sham Ismail