Bernard Journet
LPQM (CNRS UMR-8537) École normale supérieure Paris-Saclay, CentraleSupelec, Université Paris-Saclay, France

Published : 1 Documents Claim Missing Document
Claim Missing Document
Check
Articles

Found 1 Documents
Search
Journal : TELKOMNIKA (Telecommunication Computing Electronics and Control)

Design and fabrication of A Ku-band low noise amplifier using FR-4 substrate Linh Ta Phuong; Bernard Journet; Duong Bach Gia
TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 18, No 1: February 2020
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/telkomnika.v18i1.13196

Abstract

The low noise amplifier (LNA) plays an important role in many communication systems, especially at the receiver’s front-ends. In modern RF designs, The LNA is usually fabricated on a microstrip printed circuit board (PCB) due to its simplicity and ability of integrating flexibly with other components in a receiving circuitry unit. At frequencies lower than 6 GHz, the most prevalent substrate material for a microstrip LNA is FR-4 while at higher frequencies of over 10 GHz, it is challenging to design the LNA using this material without causing considerable losses to the RF signal. There are many works related to design microstrip LNA at high frequencies, however, the dielectric substrates used in most of them were high-cost materials for low dielectric loss. This paper introduces an LNA topology using the common, low-cost FR-4 substrate which can be operated in Ku-band for applications such as small satellites’ receivers, with the expected noise figure of lower than 1 dB, gain of around 10 dB and the return loss of around -10 dB. The stepped impedance matching technique has been used for transmission line optimization. The simulated and measured results are presented.