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Tajul AA
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Design Optimization of Multi Vacuum Manifold for Semiconductor Industry Taufik R.S; Tan S.T; Hambali A; Tajul AA; Sivarao Sivarao
Industrial Engineering Journal Vol 1, No 1 (2012)
Publisher : Faculty of Engineering, Universitas Malikussaleh

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.53912/iejm.v1i1.128

Abstract

This paper presents the design optimization of multi vacuum manifold in gripping system for semiconductor industry. The objectives of this study were to investigate the parameter of designing manifold in vacuum system and analyze the results base on simulation software. The study was focused on the air flow in manifold system. The pressure drop, type of flow involved, and improper design were the factors that influenced the flow efficiency in manifold system. The study of multi vacuum manifold was carried out the design parameters involved such as various sizes of inlet, number of inlet used and the distance between the inlets used. The simulation was performed using CAD software to present the dynamic pressure and mass flow rates. Based on the simulation result, the design with the total cross section area inlets is less or equal to out resulted better value of velocity and suction pressure distributed in each inlet. In addition, the longer distance travels by fluid from inlet to outlet affects the result obtained. In conclusion, the new design of multi vacuum manifold for semiconductor industry was proposed.
Design Optimization of Multi Vacuum Manifold for Semiconductor Industry Taufik R.S; Tan S.T; Hambali A; Tajul AA; Sivarao Sivarao
Industrial Engineering Journal Vol 1, No 1 (2012)
Publisher : Faculty of Engineering, Universitas Malikussaleh

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.53912/iejm.v1i1.129

Abstract

This paper presents the design optimization of multi vacuum manifold in gripping system for semiconductor industry. The objectives of this study were to investigate the parameter of designing manifold in vacuum system and analyze the results base on simulation software. The study was focused on the air flow in manifold system. The pressure drop, type of flow involved, and improper design were the factors that influenced the flow efficiency in manifold system. The study of multi vacuum manifold was carried out the design parameters involved such as various sizes of inlet, number of inlet used and the distance between the inlets used. The simulation was performed using CAD software to present the dynamic pressure and mass flow rates. Based on the simulation result, the design with the total cross section area inlets is less or equal to out resulted better value of velocity and suction pressure distributed in each inlet. In addition, the longer distance travels by fluid from inlet to outlet affects the result obtained. In conclusion, the new design of multi vacuum manifold for semiconductor industry was proposed.
Design of Jigs and Fixtures for Hydraulic Press Machine Taufik R.S; Hirmanto S; Hambali A; Tajul AA
Industrial Engineering Journal Vol 1, No 1 (2012)
Publisher : Faculty of Engineering, Universitas Malikussaleh

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.53912/iejm.v1i1.131

Abstract

This paper presents the design of jigs and fixtures for hydraulic press machine in manufacturing industries. The current problem in industry is facing the utilization of hydraulic press machine when the demand has increased which occurs on the gripping or holding the workpiece securely. The main objective of this study is to propose a new design of jigs and fixtures for hydraulic press to carry out the gripping problem from existing design. Several design concepts were generated and simulated to analyze using ANSYS software. The design parameters such as maximum deformation, maximum shear stress, number of contact faces, and maximum holding force were presented. Based on the simulation result, the improvement of new jigs and fixtures design for hydraulic press machine was achieved.
Co-Authors Hambali A Hirmanto S Sivarao Sivarao Tan S.T Taufik R.S