Article Per Year (5 Year)
p-Index From 2020 - 2025
0.444
P-Index
This Author published in this journals
All Journal JURNAL INTEGRASI Journal of Applied Electrical Engineering
Mustanir Mustanir
Politeknik Negeri Batam
Control & Systems Engineering Electrical & Electronics Engineering Other

Published : 2 Documents Claim Missing Document
Claim Missing Document
Check
Articles

Found 2 Documents
Search

 1 
Study of Lead-Free Solder Joint Reliability Hana Mutialif Maulidiah; Budiana Budiana; Widya Rika Puspita; Adlian Jefiza; Mustanir Mustanir
JURNAL INTEGRASI Vol 14 No 1 (2022): Jurnal Integrasi - April 2022
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/ji.v14i1.3910

Abstract

Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today's world. In the electronic manufacturing industry, alternative soldering materials based on tin metal have developed gradually over the last two decades. Manufacturing companies are primarily concerned about removing lead from electronic manufacturing and waste recycling by switching to the lead-free solder. Environmental and human health are adversely affected by exposure to high lead levels in consumer products. The manufacturing industry has switched to lead-free soldering to support their social responsibility initiatives. The three categories of lead-free solder are classified according to temperature range: high-temperature solder, medium-temperature solder, and low-temperature solder. This research is conducted based on the approach of study literature, which is obtained from some papers that generally explain lead-free solder. To provide additional knowledge which is expected to add new insights about the importance of lead-free usage and its behavior.
Penggunaan SEM dan Image-J dalam Mempelajari Ketebalan Lapisan Mikrostruktur Muhammad Iqbal; Muhammad Firdaus; Muhammad Al Fauzan; Meilan Novayanti; Fathiyyah Syahidah Sujana; M. Rifan Maulana; Hana Mutialif Maulidiah; Widya Rika Puspita Rika Puspita; Mustanir Mustanir; Adlian Jefiza; Budiana Budiana; Nur Sakinah Asaad
Journal of Applied Electrical Engineering Vol. 5 No. 2 (2021): JAEE, December 2021
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v5i2.3746

Abstract

Telah dilakukan penelitian terkait dengan ketebalan lapisan mikrostruktur dengan menggunakan SEM (Scanning Electron Microscope) dan Image-J. Sampel diuji dengan menggunakan SEM untuk mendapatkan mikrostruktur dari sampel. Setelah mikrostruktur didapatkan maka dilakukan analisa ketebalan lapisan mikrostruktur dengan menggunakan teknik pengukuran secara langsung menggunakan SEM dan teknik pengukuran tidak langsung menggunakan aplikasi Image-J. Berdasarkan hasil penelitian yang telah dilakukan, pengukuran ketebalan lapisan dengan menggunakan SEM dan Image-J menunjukkan pola kurva yang sama untuk semua ketebalan lapisan. Persentase perbedaan pengukuran ketebalan lapisan dengan menggunakan SEM dan Image J adalah 0.7% untuk lapisan ke-1, 1,6 % untuk lapisan ke-2 dan 0.8 % untuk lapisan ke-3. Persentase perbedaan tersebut sangat kecil (<2%) sehingga aplikasi Image-J ini dapat digunakan sebagai alternatif di dalam pengukuran ketebalan lapisan mikrostruktur
Co-Authors Adlian Jefiza Fathiyyah Syahidah Sujana Hana Mutialif Maulidiah M. Rifan Maulana Meilan Novayanti Muhammad Al Fauzan Muhammad Firdaus Muhammad Iqbal Nur Sakinah Asaad Widya Rika Puspita Widya Rika Puspita Rika Puspita