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Wang Cheng
Beijing Institute of Technology

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Simulation research on ultrasonic guided waves detection of metal rod buffer system bonding quality Yang Hu; Wang Cheng
Indonesian Journal of Electrical Engineering and Computer Science Vol 11, No 3: March 2013
Publisher : Institute of Advanced Engineering and Science

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Abstract

The judgment of metal rod buffer system bonding quality depends on the bond of the metal rods with the surrounding medium. System bonding area will lead to different reflection amplitude. Compared the simulation with the experiment, it can be concluded that different bonding area can measure bond quality, i.e, the greater the bonding area is the more excellent bonding quality will be. This conclusion provides the basis for the system ultrasonic testing. DOI: http://dx.doi.org/10.11591/telkomnika.v11i3.2193
Co-Authors Yang Hu