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Numerical Analysis of Heat Transfer Enhancement in Wavy Trapezoidal and Rectangular Microchannels Hazra, Soumik Kumar
International Journal of Innovation in Mechanical Engineering and Advanced Materials Vol 7, No 2 (2025)
Publisher : Universitas Mercu Buana

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/ijimeam.v7i2.31555

Abstract

This study presents a comprehensive numerical investigation of heat transfer enhancement in microchannels with varying geometries, specifically focusing on wavy microchannels with trapezoidal and rectangular cross-sections. Water is used as the working fluid, and silicon is selected as the solid wall material. A three-dimensional conjugate heat transfer model is developed by solving the steady-state Navier–Stokes and energy equations using the finite volume method in ANSYS Fluent, with the SIMPLEC algorithm employed for pressure–velocity coupling. The analysis examines the influence of cross-sectional shape and wall waviness on thermal performance, while maintaining a constant hydraulic diameter across all configurations. Eight different geometries, including smooth and wavy versions of rectangular and trapezoidal cross-sections with varying top-to-bottom width ratios (0.075–0.055 mm), are evaluated over a Reynolds number range corresponding to inlet velocities of 0.5–4.0 m/s. Results show that wavy microchannels significantly enhance heat transfer compared to their smooth counterparts. For instance, at 4 m/s, the Nusselt number for the wavy rectangular microchannel reaches 9.48, compared to 7.19 for the smooth rectangular configuration, representing a 32% enhancement. Similarly, the wavy trapezoidal channel with a top width of 0.18 mm achieves a maximum Nusselt number of 9.25, compared to 7.19 for its smooth equivalent, indicating a 29% improvement. Additionally, the Nu/Nu₀ versus Re plots reveal a consistent trend of increased heat transfer due to wall waviness across all geometries, with negligible influence from cross-sectional shape when hydraulic diameter is kept constant. The study demonstrates that incorporating wavy structures into microchannel designs significantly improves thermal performance with minimal increases in pressure drop, and that the effect is driven more by wall geometry than by cross-sectional shape. These findings provide valuable insights for the development of compact and efficient microchannel heat sinks for electronic cooling applications.
Numerical Study of Nano Enhanced PCM Incorporated Heat Sink with Wavy Shaped Plate Fins Hazra, Soumik Kumar
International Journal of Innovation in Mechanical Engineering and Advanced Materials Vol 8, No 1 (2026): Article in Press
Publisher : Universitas Mercu Buana

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.22441/ijimeam.v8i1.35039

Abstract

Modern high-power electronic devices require efficient passive cooling strategies to maintain safe operating temperatures. This study presents a two-dimensional numerical investigation of a nano-enhanced phase change material (NePCM)-based heat sink incorporating wavy-shaped plate fins. The NePCM consists of paraffin with 3 wt% CuO nanoparticles to enhance thermal conductivity. The novelty of this work lies in the integration of wavy-shaped fins to promote natural convection and accelerate PCM melting, thereby improving heat dissipation performance. The governing continuity, momentum, and energy equations are solved using the enthalpy–porosity method under a constant heat flux of 10,000 W/m² and a convective boundary condition of 10 W·m⁻²·K⁻¹. Parametric analyses are conducted by varying the number of cavities (3, 5, and 7) and fin height (40–50 mm). The results show that the NePCM heat sink reduces the peak temperature from 438 K (conventional) to 381 K, corresponding to a reduction of approximately 13% after 30 minutes. The wavy fin configuration enhances fluid circulation within the molten PCM, leading to faster melting and improved heat absorption. Increasing cavity number from 3 to 7 reduces the average temperature by up to ~7 K, while increasing fin height to 50 mm further lowers the temperature by approximately 10–20 K compared to shorter fins. The combined effect of latent heat storage and enhanced natural convection induced by wavy fins significantly improves thermal management performance, making the proposed design a promising solution for compact electronic cooling applications.