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All Journal Bulletin of Electrical Engineering and Informatics
S. Nayak, Deekshitha
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Electrical & Electronics Engineering

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An economical approach of structural strength monitoring utilizing internet of things S. Nayak, Deekshitha; Kumar Pandey, Anubhav
Bulletin of Electrical Engineering and Informatics Vol 14, No 3: June 2025
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/eei.v14i3.8752

Abstract

In the current environment, structural health monitoring (SHM), has become increasingly important. The cost of sensors and connectivity has significantly decreased, allowing for remote data gathering for critical analysis and structure monitoring. This allows for the assessment and improvement of the structures' residual lifespan. The internet of things (IoT) is a network of intelligent sensors that combines the identification and detection followed by sending the different structural responses to remote computers for further analysis i.e., processing and monitoring. In this work, an integrated IoT platform for damage detection is proposed which includes an Arduino, Wi-Fi module, and sensors. The sensors gather responses from the host structure which follows a precise mathematical model is introduced to determine and measure the structural damage in comparison to the reactions of the structural member that is in good health. To determine the degree of damage, the responses recorded from the damaged and healthy beams are analyzed using the cross-correlation (CC) damage index. Moreover, the analysis carried out reveals the CC values are uploaded to the cloud, where, if the CC value is over the threshold limit, a mobile warning message is delivered.
Co-Authors Kumar Pandey, Anubhav