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All Journal Journal of Applied Electrical Engineering
Vivin Octowinandi
Politeknik Negeri Batam, Batam, Indonesia
Control & Systems Engineering Electrical & Electronics Engineering

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Sistem Telemetri Akusisi Data Injeksi Plastik Menggunakan Xbee Pro S2C Irwanto Zarma Putra; Yopie Manurung; Illa Aryeni; Vivin Octowinandi; Erita Astrid; Citra Dewi; Ricky Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5312

Abstract

Plastic injection machine is a plastic product making machine with an injection molding process. Plastic injection machines at PT Shimano Batam currently cannot be monitored automatically. Therefore, a system is needed that monitors and stores all data about the performance of the plastic injection machine automatically. In this system Arduino Uno is used as a microcontroller of the plastic injection machine signal and the Xbee Pro S2C module is used as a sender and receiver of data packets from the plastic injection machine, the data is processed and then displayed on a PC and stored on the server. The test results of this system show that the machine status data matches the data displayed on the PC. From the results of testing the engine cycle time as much as 11 times, there is the largest difference in processing time, which is 1.20 seconds. From the results of reliability testing, packet loss was obtained by 0.006%. Xbee Pro S2C communication testing with a distance of 1 meter to 60 meters was successful without any data packets lost, when testing Xbee Pro S2C communication with a distance of 85 meters to 110 meters there were 30 data packets lost.
Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin Vivin Octowinandi; Fadli Firdaus; Ridwan Ridwan; Diono Diono; Rifqi Amalya F; Muhammad Naufal Airlangga Diputra; M Rif'an Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5492

Abstract

The PCB manufacturing process involves many processes, one of which is Surface finishes. One type of Surface finishes commonly used is Immersion tin. Immersion tin is a Surface finishes process that uses pure tin in the process. Immersion tin protects the copper from oxidation and makes the copper surface or pad easy to solder. The cleanliness of the pad and the thickness of the Immersion tin affect the quality of the PCB produced. Therefore, the researchers evaluated the quality of the results of the Immersion tin process using the DOE (Design of Experiment) method. Where this method can help in determining the optimal parameters. The variables used are Storage Time After Microetch and Immersion in tin Bath. In the research process it was found that PCBs underwent morphological changes at 23 hours after being stored in storage. This is caused by the presence of moisture that is still present on the PCB as a result of not being optimal during the drying process. In this study, the optimal Solder Coating Thickness in the 14th sample was 4.59 µm and with the parameters Storage Time After Microetch for 50 minutes and Immersion in tin Bath for 120 minutes. For the most optimal pad cleanliness found in the 5th and 12th samples with the Storage Time After Microetch parameter for 30 minutes and 60 minutes and marked by the absence of contaminants on the pad. In addition, in this study there were less than optimal mapping results marked by only 1 part of 1 sample containing tin from 16 test samples. The sample is the 3rd sample with the parameter Storage Time After Microetch for 10 minutes and Immersion in tin Bath for 55 minutes with a tin content of 91.9%.
Co-Authors Citra Dewi Diono Diono Erita Astrid Fadli Firdaus Illa Aryeni Irwanto Zarma Putra M Rif'an Maulana Muhammad Naufal Airlangga Diputra Ricky Maulana Ridwan Ridwan Rifqi Amalya F Yopie Manurung