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All Journal Indonesian Journal of Electrical Engineering and Computer Science
Hamid, Nurfaizey Abd
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Relationship between voltage and resistance in hybrid nanoconductive ink on different substrates in wet and dry conditions Shari, Norashikin; Hamid, Nurfaizey Abd; Photong, Chonlatee; Watson, Alan J.; Salim, Mohd Azli
Indonesian Journal of Electrical Engineering and Computer Science Vol 41, No 1: January 2026
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijeecs.v41.i1.pp18-32

Abstract

Hybrid graphene nanoplatelet/silver (GNP/Ag/SA) conductive inks are increasingly used in flexible electronics, yet there is limited understanding of how substrate type, solvent composition, and moisture exposure jointly control the electrical performance on metal and polymer substrates. This work aims to clarify how terpinol content (5T, 10T, 15T) and substrate properties of copper (Cu), polyethylene terephthalate (PET), and thermoplastic polyurethane (TPU) influence voltage, resistance, and resistivity of screen-printed GNP/Ag/SA tracks under dry and postimmersion wet conditions. GNP/Ag/SA inks were formulated with fixed butanol and varied terpinol contents, printed on Cu, PET, and TPU, and characterized using electrical measurements, adhesion evaluation, and microstructural observations to relate resistivity trends to morphology, surface energy, and hygroscopic behavior. The Cu substrate showed the best performance, with Cu 10T achieving the lowest dry resistivity of approximately 1.2×10-5 Ω.m and Cu 15T the lowest wet resistivity of approximately 2.0×10-5 Ω.m, supported by dense, well-adhered microstructures. The PET exhibited higher resistivity values up to about 10-3 Ω.m and clear degradation after water immersion, while TPU showed very high or unmeasurable resistivity in wet conditions caused by severe ink loss and hygroscopic swelling, highlighting the important role of substrate surface energy and moisture response in determining the reliability of GNP/Ag/SA inks for applications in humid or wet environments.
Co-Authors Photong, Chonlatee Salim, Mohd Azli Shari, Norashikin Watson, Alan J.