International Journal of Electrical and Computer Engineering
Vol 13, No 4: August 2023

Numerical analysis in Ar-H2 coupled-coil inductively coupled thermal plasma with Si feedstock for stable operation

Yulianta Siregar (Universitas Sumatera Utara)
Yasunori Tanaka (Kanazawa University)



Article Info

Publish Date
01 Aug 2023

Abstract

In nanopowder synthesis, the starting powder to be evaporated is infused in a plasma torch through the upper coil and the lower coil in the coupled model of inductively coupled thermal plasma (coupled-coil inductively coupled thermal plasma (ICTP)). Mixing these evaporated materials to form the coupled ICTP significantly influences the thermodynamic and transport properties. It is essential to understand these complex interactions between coupled ICTP and feedstock evaporation. This research investigated the thermal interactions between silicon raw material powder (Si) with ICTP in coupled 99%Ar/1%H2 through the numerical model developed for the synthesis of Si nanopowder. The feed rate of the Si raw material was set at 0.05, 0.1, and 0.5 g/min. This implies that the increased Si feed is too heavy to vaporize all the injected feed.

Copyrights © 2023






Journal Info

Abbrev

IJECE

Publisher

Subject

Computer Science & IT Electrical & Electronics Engineering

Description

International Journal of Electrical and Computer Engineering (IJECE, ISSN: 2088-8708, a SCOPUS indexed Journal, SNIP: 1.001; SJR: 0.296; CiteScore: 0.99; SJR & CiteScore Q2 on both of the Electrical & Electronics Engineering, and Computer Science) is the official publication of the Institute of ...