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All Journal International Journal of Electrical and Computer Engineering TELKOMNIKA (Telecommunication Computing Electronics and Control)
Yasunori Tanaka
Kanazawa University
Computer Science & IT Electrical & Electronics Engineering

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Influence of input power in Ar/H2 thermal plasma with silicon powder by numerical simulation Yulianta Siregar; Yasunori Tanaka; Yoshihiko Uesugi; Tatsuo Ishijima
TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 17, No 2: April 2019
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/telkomnika.v17i2.10533

Abstract

Numerical simulation in inductively coupled thermal plasma was made on the temperature distribution in argon (Ar)+hydrogen (H2) induction thermal plasma torch with silicon (Si) powder injection to obtain the temperature distribution and gas flow fields. The ICTP model was used in this research because it has benefit of good repeatability and no contamination process. Interactions between ICTP and injected powder are very complicated to be understood only by related experiments. Influence of input power in ICTP was numerically investigated on thermal plasma temperature fields and powder evaporation. The temperature distributions of thermal plasma and Si vapor distribution were compared at input powers of 20 kW, 30 kW, and 40 kW. Results indicated that higher input power increases the temperature of the thermal plasma with doughnut shape but it slightly enhances evaporation of the powder at the center axis of the plasma torch.
Numerical analysis in Ar-H2 coupled-coil inductively coupled thermal plasma with Si feedstock for stable operation Yulianta Siregar; Yasunori Tanaka
International Journal of Electrical and Computer Engineering (IJECE) Vol 13, No 4: August 2023
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijece.v13i4.pp3695-3705

Abstract

In nanopowder synthesis, the starting powder to be evaporated is infused in a plasma torch through the upper coil and the lower coil in the coupled model of inductively coupled thermal plasma (coupled-coil inductively coupled thermal plasma (ICTP)). Mixing these evaporated materials to form the coupled ICTP significantly influences the thermodynamic and transport properties. It is essential to understand these complex interactions between coupled ICTP and feedstock evaporation. This research investigated the thermal interactions between silicon raw material powder (Si) with ICTP in coupled 99%Ar/1%H2 through the numerical model developed for the synthesis of Si nanopowder. The feed rate of the Si raw material was set at 0.05, 0.1, and 0.5 g/min. This implies that the increased Si feed is too heavy to vaporize all the injected feed.
Co-Authors Tatsuo Ishijima Yoshihiko Uesugi Yulianta Siregar Yulianta Siregar