Bulletin of Electrical Engineering and Informatics
Vol 13, No 6: December 2024

Exploring the synergy: AI and ML in very large scale integration design and manufacturing

Gonsai, Sima K. (Unknown)
Sheth, Kinjal Ravi (Unknown)
Patel, Dhavalkumar N. (Unknown)
Tank, Hardik B. (Unknown)
Desai, Hitesh L. (Unknown)
Rana, Shilpa K. (Unknown)
Bharvad, Suresh Laxmanbhai (Unknown)



Article Info

Publish Date
01 Dec 2024

Abstract

With the rapid advancements in very large scale integration (VLSI) and integrated circuit (IC) technology, the complexity of devices has escalated significantly. Designing a VLSI chip is essential for scaling up the capabilities of chips to meet the growing demands of modern applications, like artificial intelligence (AI), IoT, and high-performance computing. Chip testing and verification also emerges as crucial tasks to ensure optimal device functionality. Testing verifies the integrity of a circuit’s gates and connections, ensuring accurate operation. Throughout the chip’s design and development life cycle, design, testing and verification composes a substantial portion of the effort. AI and machine learning (ML) are used in many different research domains to improve predicted accuracy, automate difficult jobs, provide data-driven insights, and optimise workflows. This study aims to showcase the vital role of AI/ML in reducing complexity in VLSI chip design life cycle by automating test pattern generation and fault detection, enhancing efficiency and accuracy, and significantly reducing the time and resources needed for design verification and optimization.

Copyrights © 2024






Journal Info

Abbrev

EEI

Publisher

Subject

Electrical & Electronics Engineering

Description

Bulletin of Electrical Engineering and Informatics (Buletin Teknik Elektro dan Informatika) ISSN: 2089-3191, e-ISSN: 2302-9285 is open to submission from scholars and experts in the wide areas of electrical, electronics, instrumentation, control, telecommunication and computer engineering from the ...