G-Tech : Jurnal Teknologi Terapan
Vol 9 No 3 (2025): G-Tech, Vol. 9 No. 3 July 2025

Reduction of Cu and Cr Metal Content in Electroplating Industrial Liquid Waste Using the Ion Exchange Method

Khairunnisa, Tsabitah Nabilah (Unknown)
Herazi, Yesi Nabila Zahro (Unknown)
Yogaswara, Rachmad Ramadhan (Unknown)
Billah, Mu’tasim (Unknown)
Triana, Nurul Widji (Unknown)



Article Info

Publish Date
18 Jul 2025

Abstract

Electroplating industrial waste contains toxic chemicals that pose risks to health and environment, especially if they enter household wastewater systems. Therefore, treatment is necessary to reduce heavy metal content using the ion exchange method. This study utilized Amberlite IR 120Na resin as the ion exchange medium in electroplating waste. This study aims to reduce metal content in electroplating industrial wastewater using the ion exchange method by evaluating the effects of resin height and flow rate. The process was conducted with variations in flow rate (100 ml/min, 200 ml/min, 300 ml/min, 400 ml/min, 500 ml/min) and resin height (3 cm, 6 cm, 9 cm, 12 cm, 15 cm). The waste was passed through the ion exchange column, and the remaining Cu and Cr metal concentrations were measured. The results indicated that the optimal conditions occurred at a flow rate of 100 ml/min and a resin height of 15 cm, achieving a reduction of Cu metal by 90.16% and Cr metal by 83.36%. The Cu concentration after the process met quality standards under all conditions, while the Cr concentration met quality standards at resin heights of 12 cm and 15 cm. The ion exchange method proved effective in reducing heavy metal pollution.

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Journal Info

Abbrev

g-tech

Publisher

Subject

Computer Science & IT Decision Sciences, Operations Research & Management Energy Engineering

Description

Jurnal G-Tech bertujuan untuk mempublikasikan hasil penelitian asli dan review hasil penelitian tentang teknologi dan terapan pada ruang lingkup keteknikan meliputi teknik mesin, teknik elektro, teknik informatika, sistem informasi, agroteknologi, ...