This mini-review summarizes recent advances in understanding how external magnetic fields influence the surface roughness of thin film produced by electrodeposition. The application of magnetic fields during deposition introduces magnetohydrodynamic (MHD) effects that modify ion transport, nucleation, and lapisan growth behavior. Studies across Fe-, Co-, and Ni-based systems demonstrate that parallel magnetic fields promote smoother, denser, and more uniform deposits by enhancing ionic convection and stabilizing the diffusion layer, whereas perpendicular fields frequently induce columnar or rougher surfaces due to localized microvortices and stress accumulation. The extent of roughness reduction depends nonlinearly on magnetic field intensity—moderate fields (0.3–1.0 T) typically yield optimal smoothing, while excessive fields (>1.5 T) can cause turbulence and morphological instability. Quantitative analyses reveal reductions in RMS roughness of 40–80% under appropriate field conditions, accompanied by refined grain structure and improved lapisan compactness. Overall, magnetic-field-assisted electrodeposition provides a controllable and scalable approach for tailoring thin film morphology, bridging the performance gap between electrochemical and vacuum-based deposition techniques. Its implementation offers new opportunities for developing high-quality film for spintronic devices, magnetic sensors, and microelectronic applications
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