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Applied Engineering, Innovation, and Technology
Published by MSD Institute
ISSN : -     EISSN : 30480736     DOI : -
Core Subject : Engineering,
Applied Engineering, Innovation, and Technology (AEIT) publishes high-quality papers on Applied engineering; Applied science; and Technological innovation. Original research papers, review papers, and case study reports are considered and peer-reviewed in this journal.
Articles 24 Documents
Evaluation of Road Performance under the Influence of Volunteer Traffic Regulators (Supeltas): A Case Study in Pekanbaru Zebua, Surya Abdillah
Applied Engineering, Innovation, and Technology Vol. 2 No. 2 (2025)
Publisher : MSD Institute

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.62777/aeit.v2i2.54

Abstract

Traffic congestion remains a major challenge in Indonesian cities, where limited enforcement capacity has led to the emergence of Volunteer Traffic Regulators (Supeltas) as community-based traffic managers. This study evaluates the impact of Supeltas on traffic performance at a U-turn on Jl. Soekarno Hatta, Pekanbaru City. A mixed-method approach combining qualitative observation and quantitative road performance analysis was employed, following the Indonesian Road Capacity Guidelines (PKJI) and U-turn Planning Guidelines (PPPB). Traffic data were collected over two weeks under conditions with and without Supeltas. The results show that Supeltas increase vehicle volume at the U-turn (from 2,131 to 2,168 pcu/hour) but also reduce average speed (from 42 km/h to 37 km/h) and raise the degree of saturation from 0.36 to 0.49, shifting the Level of Service from B to C. These findings indicate that while Supeltas help manage driver behavior and encourage U-turn utilization, their presence also contributes to higher congestion levels due to inconsistent manual signaling. Improved Supeltas training and dedicated U-turn lanes are recommended to enhance operational efficiency and safety.
Visualizing Digital Modulation Techniques with Simulink and Raspberry Pi 4 Obeng, Lydia Dede; Aguadze, Michael; Arkorful, Isaac Papa Kwesi
Applied Engineering, Innovation, and Technology Vol. 2 No. 2 (2025)
Publisher : MSD Institute

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.62777/aeit.v2i2.87

Abstract

Digital modulation techniques are fundamental to modern communication systems, enabling the reliable transmission of data over wireless, optical, and wired channels. This research focuses on designing, implementing, and visualizing three key digital modulation schemes: Amplitude-Shift Keying (ASK), Frequency-Shift Keying (FSK), and Quadrature Phase-Shift Keying (QPSK) using MATLAB Simulink and the Raspberry Pi 4 platform. Performance evaluation through oscilloscope visualization demonstrated robust signal integrity: the 2-ASK transmitter exhibited clear amplitude changes at a 15 kHz carrier frequency, accurately representing binary data with minimal observed noise (qualitative SNR improvement over unmodulated signals) and negligible distortion. The 2-FSK transmitter produced distinct frequency shifts between 4.8 kHz and 9.6 kHz, encoding binary 1 and 0 with low error potential in noise-free conditions, as confirmed by waveform observations. The QPSK transmitter displayed smooth phase transitions at 15 kHz, cycling through four phase states (45°, 135°, 225°, 315°), effectively doubling the data rate compared to BPSK while maintaining phase accuracy within hardware latency limits (approximately 10-20 ms processing delay). The ability to visualize and analyze these methods supports the development of improved modulation schemes, contributing to more efficient and robust digital communication systems.
Future Directions in Semiconductor Processing: Scaling, Integration, and the Sustainability Imperative Ramatu Al-hassan; Edmun Dasori Azundow; Yaw Amankrah Sam-Okyere; Emmanuel Osei-Kwame; Nii Ayitey Freddie Aryee
Applied Engineering, Innovation, and Technology Vol. 3 No. 1 (2026)
Publisher : MSD Institute

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.62777/aeit.v3i1.97

Abstract

The global semiconductor industry has navigated a period of intense innovation and systemic challenges between 2020 and 2025. Driven by the exponential demands of Artificial Intelligence (AI), 5G/6G communication, and high-performance computing (HPC), the sector has pursued a dual strategy of continued transistor scaling and sophisticated heterogeneous integration. This review systematically analyzes the critical advancements and challenges within this period. We detail the fundamental architectural shift from FinFET to Gate-All-Around (GAA) transistors, enabling the 3-nanometer (nm) and 2-nm nodes, and the adoption of Extreme Ultraviolet (EUV) lithography for High-Volume Manufacturing (HVM). Concurrently, advanced packaging techniques, such as hybrid bonding and the standardization of chiplet architectures via the Universal Chiplet Interconnect Express (UCIe), have emerged as indispensable means to circumvent planar scaling limits. Economically, the industry has contended with escalating capital expenditure (CapEx) and the severe global chip shortage (2020–2023), prompting widespread government intervention, notably through the U.S. CHIPS Act and the EU Chips Act. Crucially, the review addresses the intensifying sustainability mandate, examining the challenges posed by high-Global Warming Potential (GWP) gas emissions, soaring water consumption, and the necessary transition toward circular economy principles within the fabrication environment. The findings underscore that future progress is contingent upon balancing relentless performance demands with resilient supply chains and comprehensive environmental stewardship.
A Cross-Platform Mobile Attendance System Utilizing Geofencing and Multi-Factor Authentication Wisdom Korkortsi; Edmund Dasori Azundow; Ramatu Al-Hassan; Yaw Amankrah Sam-Okyere; Mohammed Izzu-deen Zakariah
Applied Engineering, Innovation, and Technology Vol. 3 No. 1 (2026)
Publisher : MSD Institute

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.62777/aeit.v3i1.100

Abstract

The challenge of accurately managing student attendance in higher education persists due to the limitations of manual methods, such as susceptibility to fraud and inefficiency amid growing enrollments. This paper introduces a cross-platform mobile attendance system developed using the Flutter framework and Google Firebase backend, incorporating geofencing and device-binding multi-factor authentication to ensure secure, "foolproof" verification. The system operates on a BYOD model, eliminating hardware costs while supporting both Android and iOS devices. A simulation test with 30 students evaluated performance, yielding an average verification time of 8.7 seconds, 98% authentication success rate, and effective fraud prevention against unauthorized devices and out-of-location check-ins. Results highlight the system's robustness, low latency, and adaptability to location errors via dynamic geofencing. This scalable, cost-effective solution addresses gaps in existing systems, including platform exclusivity and privacy concerns from biometrics, making it ideal for Ghanaian universities facing resource constraints and large class sizes.

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