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All Journal Mechatronics, Electrical Power, and Vehicular Technology
Estiko Rijanto
Research Centre for Electrical Power & Mechatronics, Indonesian Institute of Sciences, Komp LIPI Jl Cisitu 21/54D, Gd 20, Bandung 40135
Electrical & Electronics Engineering

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A Review of Atomic Layer Deposition for Nanoscale Devices Edy Riyanto; Estiko Rijanto; Budi Prawara
Journal of Mechatronics, Electrical Power and Vehicular Technology Vol 3, No 2 (2012)
Publisher : National Research and Innovation Agency

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.14203/j.mev.2012.v3.65-72

Abstract

Atomic layer deposition (ALD) is a thin film growth technique that utilizes alternating, self-saturation chemical reactions between gaseous precursors to achieve a deposited nanoscale layers. It has recently become a subject of great interest for ultrathin film deposition in many various applications such as microelectronics, photovoltaic, dynamic random access memory (DRAM), and microelectromechanic system (MEMS). By using ALD, the conformability and extreme uniformity of layers can be achieved in low temperature process. It facilitates to be deposited onto the surface in many variety substrates that have low melting temperature. Eventually it has advantages on the contribution to the wider nanodevices.
Co-Authors Budi Prawara Edy Riyanto