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All Journal Jurnal Ilmiah Wahana Pendidikan
Rizky Miftahul Amri
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Analisis Proses Transfer Molding Pembuatan Semiconductor Package Pada New Remocon Rizky Miftahul Amri; Kardiman Kardiman; Aripin Aripin
Jurnal Ilmiah Wahana Pendidikan Vol 8 No 8 (2022): Jurnal Ilmiah Wahana Pendidikan
Publisher : Peneliti.net

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (318.845 KB) | DOI: 10.5281/zenodo.6609332

Abstract

The manufacturing process is the processing of a raw material into a product. An example of a material used for manufacturing is plastic. Currently, more than 99% of microelectronic devices are packaged in plastic. One of the manufacturing processes used is transfer molding. Transfer molding is the most commonly used encapsulation method for integrated circuit technology in closed molding using thermosetting plastics which are transferred under pressure. The results of the observations that have been made, transfer molding aims to create a package that protects the chip and wire from the outside environment, electrical connections with the outside, releases heat, and makes assembly easier. The transfer molding process parameters include mold temperature, transfer pressure, mold-clamping pressure, and time to fill the cavity.
Co-Authors Aripin Aripin Kardiman