Article Per Year (5 Year)
p-Index From 2020 - 2025
0.23
P-Index
This Author published in this journals
All Journal Indonesian Review of Physics (IRiP)
Willi Anindita Wijanarka
Universitas Ahmad Dahlan
Astronomy Earth & Planetary Sciences Education Materials Science & Nanotechnology

Published : 1 Documents Claim Missing Document
Claim Missing Document
Check
Articles

Found 1 Documents
Search

 1 
Effect of Deposition Voltage on Layer Thickness, Microstructure, Cu/Ni Sheet Resistivity of Deposition Results by Magnetic Field Electroplating Assisted Technique Willi Anindita Wijanarka; Moh Toifur
Indonesian Review of Physics (IRiP) Vol. 3 No. 1 (2020)
Publisher : Universitas Ahmad Dahlan

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12928/irip.v3i1.1530

Abstract

The purpose of this research is to make the Cu/Ni thin layer as an alternative to basic RTD materials through electroplating methods assisted by magnetic fields. Electroplating was carried out with variation in deposition voltage ranging from 1 to 5 V. The results of this study indicate that the deposition voltage applied to the coating affects the thickness, sheet resistivity, and microstructure of the coating. Thickness increases with increasing deposition voltage. The diffraction intensity and crystal size tend to increase with increasing deposition voltage. The distance between Bragg planes after the coating is almost equal for all samples. The highest sheet resistivity was obtained in the coating sample with a 4-volt deposition voltage.
Co-Authors Moh. Toifur