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All Journal International Journal of Informatics and Communication Technology (IJ-ICT) International Journal of Applied Power Engineering (IJAPE)
Vali, Shaik Hussain
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Computer Science & IT Electrical & Electronics Engineering

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Advancing semiconductor integration: 3D ICs and Perylene-N as superior liner material for minimizing TSV clamour coupling Dhal, Pradyumna Kumar; Rajesh, Murkur; Vali, Shaik Hussain; Krishna, Sadhu Radha; Kumar, Malagonda Siva; Rafi, Vempalle
International Journal of Informatics and Communication Technology (IJ-ICT) Vol 14, No 2: August 2025
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijict.v14i2.pp605-613

Abstract

The semiconductor industry faces substantial challenges with planar integration (2D ICs), prompting a significant shift towards vertical IC integration, known as three-dimensional IC (3D ICs). This deliberate slant not only amplifies bandwidth and boosts system action but also effectively reduces power consumption through scaling. 3D ICs intricately coordinate IC chips by vertically stacking them and establishing electrical connections using through silicon vias (TSVs). TSV clamour coupling emerges as a critical factor influencing system performance, particularly between signalcarrying TSVs (ETSV) and victim TSVs. This study showcases significant advancements in electrical integrity by effectively minimizing clamour coupling from TSVs to the silicon substrate. This is achieved through the application of CMOS-compatible dielectric materials as liner structures. Various proposed structures have been meticulously analyzed across an assortment of parameters, encompassing electrical signals and high frequencies. Moreover, the study rigorously investigates clamour coupling across different types of TSVs, including ETSV, thermal TSV (TTSV), and heat sources. Perylene-N emerges as a standout performer among the tested liner materials, demonstrating superior clamour coupling performance across all proposed models, even at higher frequencies such as THz. In this study a novel dielectric material Perylene-N compared with the conventional SiO2 (silicon dioxide). Notably, Perylene-N exhibited a remarkable 33 dB improvement in noise coupling performance at terahertz (THz) frequencies. The results were thoroughly verified and validated in the research work.
Enhanced multi-mode control of Z-source virtual synchronous generator for photovoltaic systems using fuzzy logic controller Rafi, Vempalle; Dhal, Pradyumna Kumar; Vali, Shaik Hussain; Krishna, Sadhu Radha; Suryavalli, Uppuluri; Prakash, S. Vinoth John
International Journal of Applied Power Engineering (IJAPE) Vol 14, No 3: September 2025
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijape.v14.i3.pp701-711

Abstract

An enhanced multi-mode control solution for a Z-source virtual synchronous generator (ZVSG) that makes use of a fuzzy logic controller (FLC) is proposed by this study for use in photovoltaic (PV) systems. As a potential grid integration option for PV systems, the ZVSG has great potential due to its steady and adjustable power production. A stable voltage and frequency output can be maintained by the ZVSG when it is running in a variety of modes, such as grid-connected, standalone, and islanding, according to the control approach that has been provided. The FLC is used for the purpose of controlling the switching frequency of the ZVSG as well as the DC-link voltage. The performance of the ZVSG is improved by the FLC-based control approach that has been proposed. This technique reduces the steady state error and offers a rapid dynamic response. The results of the simulation show that the recommendation for a control approach improves the performance of the ZVSG across a wide variety of operating modes and load conditions.
Co-Authors Dhal, Pradyumna Kumar Krishna, Sadhu Radha Kumar, Malagonda Siva Prakash, S. Vinoth John Rafi, Vempalle Rajesh, Murkur Suryavalli, Uppuluri