Article Per Year (5 Year)
p-Index From 2021 - 2026
0.23
P-Index
This Author published in this journals
All Journal JURNAL TEKNIK INDUSTRI
Dewi, Indah Kusuma Dewi
Unknown Affiliation
Electrical & Electronics Engineering Energy Industrial & Manufacturing Engineering

Published : 1 Documents Claim Missing Document
Claim Missing Document
Check
Articles

Found 1 Documents
Search

 1 
The Implementation of Kansei Engineering for the Development of Wheat Flour Packaging Arsinta, Dina Arsinta; Halisa, Siti Nur Halisa; Dewi, Indah Kusuma Dewi; Saputra, Angga Aditya Saputra; Sari, Novi Purnama Sari
JURNAL TEKNIK INDUSTRI Vol. 15 No. 2 (2025): July 2025
Publisher : Jurusan Teknik Industri, Fakultas Teknologi Indusri Universitas Trisakti

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.25105/jti.v15i2.19815

Abstract

Wheat flour packaging currently only uses flexible packaging of plastic materials that are inconvenient, such as being difficult to open and close, and the product's contents becoming messy. Based on this, improvements and developments are needed in wheat flour packaging. This study aims to determine the design concept and packaging elements and make a mockup of wheat flour packaging. The methods used in this study are the Kansei engineering method, Principal Component Analysis (PCA) to get design concepts, QTT1 to get design elements, and fuzzy logic for evaluation of packaging design mockups. The results are 40 packaging samples, 51 Kansei words describing the product, 3PC or 3 concepts consisting of Varied - Exclusive, Innovative - Useable, and Flexible - Reusable. The prioritized concept is PC3, based on the most considerable R-squared value of 0.9465. The seven recommended PC3 design elements consist of Rigid Plastic (X1.6), Jar (X2.2), Unfeatured (X3.1), Lug cap (X4.3), Traditional (X5.4), Direct Print (X6.2), and Illustration (X7.2).
Co-Authors Arsinta, Dina Arsinta Halisa, Siti Nur Halisa Saputra, Angga Aditya Saputra Sari, Novi Purnama Sari