Jurnal Elektronika dan Telekomunikasi
Vol. 25 No. 2 (2025)

Dual-Function Aperture-Coupled Spiral Resonator Antenna with Integrated Impedance Matching Network for Enhanced Radiation Performance

Mochamad Yunus (University of Pakuan)
Yamato Yamato (University of Pakuan)
Bloko Budi Rijadi (University of Pakuan)
Waryani Waryani (University of Pakuan)
Muhammad Farhan Maulana (Telkom University)
Teguh Firmansyah (Sultan Ageng Tirtayasa University)
Achmad Munir (Institut Teknologi Bandung)



Article Info

Publish Date
31 Dec 2025

Abstract

This paper proposes the design and implementation of a dual-function aperture-coupled spiral resonator (SR) antenna integrated with a compact impedance matching network (IMN) to achieve enhanced radiation performance and miniaturization. The antenna uses a two-layer FR4 substrate, where the SR is printed on the top layer as the radiating element and excited through a slotted aperture on the ground plane. To maximize power transfer, the IMN, consisting of an inter-digital capacitor (IDC) and a meandered inductor (MI), is embedded into the feed line on the bottom substrate. A comparative study between the conventional SR antenna and the proposed dual-function SR with IMN was conducted. Electromagnetic simulations and experimental measurements demonstrate that the integrated IMN improves the reflection coefficient (S11) by 43.64%, increases radiation efficiency from ~72% to ~87%, and enhances gain from ~3.2 dBi to ~4.8 dBi, while maintaining a compact footprint. The aperture-coupled feeding also contributes to bandwidth enhancement and isolation between the feed and radiating element. This dual-function design effectively resolves the trade-off between miniaturization and radiation performance, demonstrating its applicability for IoT, 5G, and wearable wireless devices.

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Journal Info

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jet

Publisher

Subject

Description

Jurnal Elektronika dan Telekomunikasi (JET) aims to publish high-quality articles with a specific focus on the latest research and developments in the field of electronics, telecommunications, and microelectronics engineering. It will provide a platform for academicians, researchers and engineers to ...