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All Journal JURNAL INTEGRASI Journal of Applied Electrical Engineering
Nur Sakinah Asaad
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Control & Systems Engineering Electrical & Electronics Engineering Other

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Journal : JURNAL INTEGRASI

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MODIFIKASI MESIN TRIM FORM PADA PROSES PENGEMASAN INTEGRATED CIRCUIT UNTUK PENURUNAN DAMAGED LEAD Nur Sakinah Asaad; Purwanto Purwanto
JURNAL INTEGRASI Vol 12 No 1 (2020): Jurnal Integrasi - April 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (1025.963 KB) | DOI: 10.30871/ji.v12i1.1889

Abstract

Integrated circuit (IC) packaging process of Low Profile Quad Flat Package (LQFP) needs trim form machine for trimming the dambar and forming the IC leads before separated from the lead frame. One of the process sequences in trim form machine is offload, placement of IC units in the tray by pick and place module including open and close of turn table movement to adjust space between lead frame columns before transferred to tray. Open and close movement of the turn table impact to damaged lead production defect. Modification intended to misalignment earlier detection so that the machine can stop automatically and decrease production defect by adding two proximity sensor on turn table. Based on the result of this research, the error on turn table could be reduced to 88% with assembly yield achieved 99.985% or increase up to 0.07%.
DESIGN OF EXPERIMENT (DOE) LIQUID PHOTOIMAGEABLE SOLDER MASKS PCB PADA TEACHING FACTORY MANUFACTURING OF ELECTRONICS (TFME) POLITEKNIK NEGERI BATAM Nadhrah Wivanius; Nur Sakinah Asaad; Heru Wijanarko; Ira Zamzami
JURNAL INTEGRASI Vol 12 No 1 (2020): Jurnal Integrasi - April 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (788.177 KB) | DOI: 10.30871/ji.v12i1.1987

Abstract

This paper examines several variables to formulated the best parameters in the PCB manufacturing process. This study was implements a PCB with a screen printing process that uses the LPISM (Liquid Photoimageable Solder Mask) application. Where in the process PCB coating is done by connecting the amount of solder liquid mask in one coating using the right parameters using the Design of Experiment (DoE) method. This DoE method improves the quality of the PCB at the lowest possible cost. DoE on LPISM applied at the Teaching Factory Manufaktur Elektronika Politeknik Negeri Batam with the aim of protecting the PCB lines from being connected to one another, providing the right measurements, and using the use of laminated mask solder. Thus, Politeknik Negeri Batam Teaching Factory laboratory assistants can produce PCBs using the LPISM method with quality according to standards. From the analysis, obtained an appropriate angle for screen printing is between 150-200 so that the screen is not damaged. In addition, the oven process can thin the solder mask up to 70-80%. In accordance with the results of comprehensive testing, the 24th data obtained can be recommended because it fulfill the IPC-SM-840C standard, with the 2.5 μm solder mask thickness.
Design of Experiment pada proses Immersion Tin Plating Widya Rika Puspita; Lindawani Siregar; Ika Karlina Laila NS; Ira Zamzami; Budiana Budiana; Fitriyanti Nakul; Nur Sakinah Asaad; Adlian Jefiza
JURNAL INTEGRASI Vol 14 No 2 (2022): Jurnal Integrasi - Oktober 2022
Publisher : Pusat Penelitian dan Pengabdian Masyarakat Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/ji.v14i2.4035

Abstract

PCB (printed circuit board) is a copper-coated board that is a container for electronic components arranged to form electronic circuits. Copper surfaces that are easy to oxidize (corrosion) need to be soothed with a layer of Sn (tin). Based on the TFME study case, the electroplating technique requires more cost for tin plating. The immersion process of the tin plating model is superior in terms of cost and quality. To determine the right combination parameters so as to obtain a thickness that is in accordance with the IPC-4554 standard, namely a minimum of 1000 nm, the research method used is Design of Experiments (DoE). There are nine experimental combinations of the DoE results. Combination parameter testing is done using a SEM (scanning electron microscope) machine. The combination of four to nine has met IPC standards with a thickness of between 1040-1540 nm. The correct parameter is obtained by the combination of 5 with the parameter temperature of 700 and time of 60 minutes, and the result is an average thickness of 1.2 µm and has an uncertain value of the measurement is 7.
Co-Authors Adlian Jefiza Fitriyanti Nakul Heru Wijanarko Ika Karlina Laila NS Ira Zamzami Lindawani Siregar Nadhrah Wivanius Nanta Fakih Prebianto Purwanto Purwanto Riki Ria Widya Rika Puspita