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All Journal JURNAL INTEGRASI Journal of Applied Electrical Engineering
Nadhrah Wivanius
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Control & Systems Engineering Electrical & Electronics Engineering Other

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Analisis Kekasaran Permukaan Besi ASTM36 dengan menggunakan Surftest dan Image –J Budiana Budiana; Fitriyanti Nakul; Nadhrah Wivanius; Budi Sugandi; Rivani Yolanda
Journal of Applied Electrical Engineering Vol 4 No 2 (2020): JAEE, December 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v4i2.2747

Abstract

Kekasaran permukaan logam merupakan salah satu parameter yang dapat dijadikan acuan dalam penilaian mutu suatu logam. Nilai kekasaran permukaan suatu bahan logam dapat dilakukan dengan pendekatan matematik dan pengukuran. Pada penelitian ini, kajian mengenai kekasaran permukaan suatu logam dilakukan dengan menggunakan pengukuran langsung dan menggunakan analisis citra gambar. Adapun teknik pengukuran langsung dilakukan dengan menggunakan Surftest pada 20 titik (5 titik dari diagonal sisi kanan, 5 titik diagonal sisi kiri, 5 titik vertikal dan 5 titik horizontal) sedangkan analisis citra gambar dilakukan dengan menggunakan Image-J pada foto gambar permukaan besi. Berdasarkan metode penelitian yang telah dilakukan diperoleh kesimpulan yaitu semakin besar nilai grit abrasive paper yang digunakan pada permukaan besi, maka nilai kekasaran permukaan besi semakin kecil/semakin halus (nilai kekasaran permukaan cenderung menurun). Sedangkan hasil pengolahan citra gambar yang dilakukan dengan Image-J telah berhasil menunjukan surface plot permukaan sampel besi. Selain dari itu, gray value dari citra gambar yang dihasilkan mengalami fluktuasi seiring dengan semakin panjang/besarnya distance (pixels).
DESIGN OF EXPERIMENT (DOE) LIQUID PHOTOIMAGEABLE SOLDER MASKS PCB PADA TEACHING FACTORY MANUFACTURING OF ELECTRONICS (TFME) POLITEKNIK NEGERI BATAM Nadhrah Wivanius; Nur Sakinah Asaad; Heru Wijanarko; Ira Zamzami
JURNAL INTEGRASI Vol 12 No 1 (2020): Jurnal Integrasi - April 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (788.177 KB) | DOI: 10.30871/ji.v12i1.1987

Abstract

This paper examines several variables to formulated the best parameters in the PCB manufacturing process. This study was implements a PCB with a screen printing process that uses the LPISM (Liquid Photoimageable Solder Mask) application. Where in the process PCB coating is done by connecting the amount of solder liquid mask in one coating using the right parameters using the Design of Experiment (DoE) method. This DoE method improves the quality of the PCB at the lowest possible cost. DoE on LPISM applied at the Teaching Factory Manufaktur Elektronika Politeknik Negeri Batam with the aim of protecting the PCB lines from being connected to one another, providing the right measurements, and using the use of laminated mask solder. Thus, Politeknik Negeri Batam Teaching Factory laboratory assistants can produce PCBs using the LPISM method with quality according to standards. From the analysis, obtained an appropriate angle for screen printing is between 150-200 so that the screen is not damaged. In addition, the oven process can thin the solder mask up to 70-80%. In accordance with the results of comprehensive testing, the 24th data obtained can be recommended because it fulfill the IPC-SM-840C standard, with the 2.5 μm solder mask thickness.
Co-Authors Budi Sugandi Fitriyanti Nakul Heru Wijanarko Ira Zamzami Nur Sakinah Asaad Rivani Yolanda