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All Journal Elkom: Jurnal Elektronika dan Komputer
Norhalena Mohd. Nor
Universiti Tenaga Nasional, Malaysia
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Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm Amna Amna; Ahmad Kamal bin Zulkifle; Norma Alias; Norhalena Mohd. Nor; Noreliza Abu Mansor; Ishak Hashim
Elkom : Jurnal Elektronika dan Komputer Vol 13 No 1 (2020): Juli: Jurnal Elektronika dan Komputer
Publisher : STEKOM PRESS

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.51903/elkom.v13i1.11

Abstract

This paper determines by simulation the temperature profiles of a thick carbon fiber/epoxy laminate during its cure process. The one-dimensional model of heat transfer is solved by using a finite difference numerical scheme. In the process, the same physical and thermal properties of materials used by ZhanSheng et al. are employed. The temperature is calculated through a judicious formulation and application of the Alternating Group Explicit (AGE) iterative method developed by Evans and Sahimi. A fourthorder Runge Kutta method is applied for the cure. The AGE scheme proves to be a viable iterative method with respect to stability, efficiency and rate of convergence.
Co-Authors Ahmad Kamal bin Zulkifle Amna Ishak Hashim Noreliza Abu Mansor Norma Alias