Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm

Amna Amna (Universitas Gajah Putih Indonesia)
Ahmad Kamal bin Zulkifle (Universiti Tenaga Nasional, Malaysia)
Norma Alias (Universiti Teknologi Malaysia)
Norhalena Mohd. Nor (Universiti Tenaga Nasional, Malaysia)
Noreliza Abu Mansor (Universiti Tenaga Nasional, Malaysia)
Ishak Hashim

Elkom: Jurnal Elektronika dan Komputer
Vol 13 No 1 (2020): Juli: Jurnal Elektronika dan Komputer

This paper determines by simulation the temperature profiles of a thick carbon fiber/epoxy laminate during its cure process. The one-dimensional model of heat transfer is solved by using a finite difference numerical scheme. In the process, the same physical and thermal properties of materials used by ZhanSheng et al. are employed. The temperature is calculated through a judicious formulation and application of the Alternating Group Explicit (AGE) iterative method developed by Evans and Sahimi. A fourthorder Runge Kutta method is applied for the cure. The AGE scheme proves to be a viable iterative method with respect to stability, efficiency and rate of convergence.