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All Journal ROTOR: JURNAL ILMIAH TEKNIK MESIN MACHINERY: Jurnal Teknologi Terapan Journal of Electronics Technology Exploration (JOeTEx)
Prabowo, Bambang
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Automotive Engineering Computer Science & IT Control & Systems Engineering Electrical & Electronics Engineering Energy Industrial & Manufacturing Engineering Materials Science & Nanotechnology Mechanical Engineering

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THE ANALYSIS THERMAL CONDUCTIVITY OF PINEAPPLE FIBER COMPOSITES EPOXY AND NA2SIO3 AS CAR LIGHT SOCKET MATERIALS Saputra, Eka Bima; Fachriza, Andry; Prabowo, Bambang; Hartono, Bibit
ROTOR Vol 16 No 2 (2023)
Publisher : Jurusan Teknik Mesin Fakultas Teknik Universitas Jember

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.19184/rotor.v16i2.37395

Abstract

Along with the increasing number of motorized vehicles and the massive renewal of it, their lifetime has become faster, especially for cars. The problem often occurs in cars that have passed their lifetime is a lighting system, one of which is that the car's light socket often melts. Car headlight sockets made of plastic and rubber which function as seals cause the socket to melt when exposed to heat. Based on the existing problems, the purpose of this research is to find new material for making car light sockets using the standard hot wire method. The production begins with mixing epoxy resin with hardener using the hand lay-up method with a ratio of 2:1. Stir mixture for 5 minutes and add the pineapple into molds (110x60x20) mm and wait for a day at room temperature. Furthermore, the thermal conductivity test using QTM-500 tester. Based on the research results, all specimens suitable for the requirements use as materials for making car light sockets, because the thermal conductivity values of all specimens (0.2231, 0.2061, 0.2249) W/mK were below the thermal conductivity values of the previous socket-making materials, 0.23 W/mK. The best specimen composition is specimen 1 with thermal conductivity value of 0.2231 W/mK. This is because specimen 1 has little porosity or voids and small conductivity value. Thus, the composition ratio that is best used in the manufacture of car light sockets based on the total mass of resin, hardener, pineapple fiber, and sodium silica is 15: 7.5: 1: 3.75. Keywords: composite, pineapple fiber, thermal conductivity, socket, catalyst
ANALISIS TERMAL SOKET LAMPU MOBIL KOMPOSIT EPOXY SERAT NANAS DENGAN PENDEKATAN METODE FEA Fachriza, Andry; Prabowo, Bambang; Dicky; Zohari, Ahmad; Saputra, Eka Bima
MACHINERY Jurnal Teknologi Terapan Vol. 5 No. 1 (2024): Machinery: Jurnal Teknologi Terapan
Publisher : Politeknik Negeri Sriwijaya, Indonesia

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.5281/zenodo.10728590

Abstract

The function of the car light socket is to connect electricity to the car lights. The car lights would result in high temperatures and melt if it is used continuously. The electrical short circuits and light sockets made from plastic can also cause melting. This research aims to find a new material for lamp sockets that has high-insulating characteristics. The researcher uses composite materials of epoxy resin and pineapple leaf fiber to make car light sockets. The thermal simulation uses Solidworks software and its parameters obtained from research journals. The maximum and minimum temperatures that resulted from the thermal simulation are 110.916 ℃ and 74.849 ℃. The melting temperature of the car light socket in the thermal simulation (pineapple fiber-epoxy resin) is higher than the previous light socket material (plastic) and the temperature when a short circuit occurs. Therefore, the pineapple leaf fiber-epoxy resin composite can be used as for car light sockets.
Automated Printed Circuit Board Inspection System using NI Vision Builder and NI MyRio Wijaya, Yusmar Palapa; Swinarno, Imam; Prabowo, Bambang; Subagiyo, Heri; Huda, Amirul; Syahbana, Dodi
Journal of Electronics Technology Exploration Vol. 2 No. 2 (2024): December 2024
Publisher : SHM Publisher

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.52465/joetex.v2i2.511

Abstract

To improve flaw identification in contemporary electronics manufacturing, this study introduces an automated printed circuit board (PCB) inspection system that integrates NI Vision Builder with NI MyRIO. The device effectively detects flaws like missing parts, open circuits, and over-etched traces by utilizing a high-resolution camera and sophisticated methods including color plane extraction and pattern matching. Real-time visualization, classification, and automated data recording are made possible via a LabVIEW-based interface, which makes the inspection process easy to use. A 92% accuracy rate was attained during testing on both bare PCBs and PCB assemblies, indicating better performance than conventional techniques. Although multi-layer and subsurface defect detection still presents difficulties, the system provides a scalable and affordable solution with the possibility to incorporate machine learning and sophisticated imaging in the future for increased adaptability.
Co-Authors Dicky Fachriza, Andry Hartono, Bibit Huda, Amirul Saputra, Eka Bima Subagiyo, Heri Swinarno, Imam Syahbana, Dodi Yusmar Palapa Wijaya, Yusmar Palapa Zohari, Ahmad