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All Journal International Journal of Electrical and Computer Engineering International Journal of Informatics and Communication Technology (IJ-ICT)
Kumar, Malagonda Siva
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Computer Science & IT Electrical & Electronics Engineering

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Journal : International Journal of Electrical and Computer Engineering

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Electrical signal interference minimization using appropriate core material for 3D integrate circuit at high frequency applications Kumar, Malagonda Siva; Mohanraj, Jayavelu
International Journal of Electrical and Computer Engineering (IJECE) Vol 14, No 3: June 2024
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.11591/ijece.v14i3.pp2500-2507

Abstract

As demand for smaller, quicker, and more powerful devices rises, Moore's law is strictly followed. The industry has worked hard to make little devices that boost productivity. The goal is to optimize device density. Scientists are reducing connection delays to improve circuit performance. This helped them understand three-dimensional integrated circuit (3D IC) concepts, which stack active devices and create vertical connections to diminish latency and lower interconnects. Electrical involvement is a big worry with 3D integrates circuits. Researchers have developed and tested through silicon via (TSV) and substrates to decrease electrical wave involvement. This study illustrates a novel noise coupling reduction method using several electrical involvement models. A 22% drop in electrical involvement from wave-carrying to victim TSVs introduces this new paradigm and improves system performance even at higher THz frequencies.
Co-Authors Dhal, Pradyumna Kumar Krishna, Sadhu Radha Mohanraj, Jayavelu Rafi, Vempalle Rajesh, Murkur Vali, Shaik Hussain