REDUCTION OF LIFTED STITCH DEFECTS IN WIRE BONDING PROCESS THROUGH ROOT CAUSE ANALYSIS

Puspita, Widya Rika
Manurung, Anjunius
budiana, Budiana
Nur Sakinah Asaad
Jefiza, Adlian
Nakul, Fitriyanti
Putra, Irwanto Zarma
Diputra, Muhammad Naufal Airlangga
Illa Aryeni
Handri Toar
Anggraini, Ria

Jurnal Teknologi dan Riset Terapan (JATRA)
Vol. 7 No. 2 (2025): Jurnal Teknologi dan Riset Terapan (JATRA) - December 2025

Reliable connection inspection is crucial for the quality of semiconductor products. A frequent issue is stitch defects during wire bonding. To address this, an investigation was conducted using flow charts. Additionally, an analysis was performed by identifying root causes using the Fishbone Diagram method and the 5 Whys technique. After improvements, including targeted operator training, a significant reduction of 96.75% in stitch defects was achieved. This study demonstrates that the combination of root cause analysis methods and operator training effectively enhances the reliability of the wire bonding process and the quality of semiconductor products. This study did not account for environmental factors that might influence the wire bonding process, such as temperature and humidity variations. Therefore, the findings may be limited in settings with different environmental conditions.