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Vivin Octowinandi
Politeknik Negeri Batam, Batam, Indonesia
Control & Systems Engineering Electrical & Electronics Engineering

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Reducing Coating Defects by Implementing Auto Dripping System on The Finishing Machine Octowinandi, Vivin; Firdaus, Fadli; Arifin, Muhammad; Maulidiah, Hana Mutialif; Iqbal, Muhammad
Journal of Applied Electrical Engineering Vol 7 No 2 (2023): JAEE, December 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i2.6722

Abstract

Finishing Process is one of the most important processes in the manufacture of resistors, because it is the process of forming the resistor body by coating the resistor with a coating liquid. However, in this process there are still many cases of product defects, one of the main causes is the uncontrolled viscosity of the coating liquid causing the formation of body resistors is not good, or what is called Body deform and body thin defects. Auto Dripping is a useful tool for automatically dripping methanol liquid which aims to control the viscosity of the coating liquid in the finishing process. Because Auto Dripping is a tool that has just been implemented and does not yet have the right parameter settings, it is necessary to do trials to find the right parameters so that Auto Dripping functions properly. In Auto Dripping there are two settings that can be controlled, namely Stroke Speed and Stroke Length, these two settings affect the output of methanol liquid that comes out. In this study using SPC tools to analyze the parameters being tested, namely the Control Chart which is used to monitor the stability of a process and study process changes from time to time. then, in this study also used the Process Capability Analysis method. This method is very effective in viewing the performance of a process, is used to measure process capability by comparing its distribution with the distribution of specifications accurately and provides a clearer picture. After carrying out this project, the authors concluded that the implementation of the Auto Dripping set up parameter has proven to be quite influential in reducing the case of coating defects caused by uncontrolled viscosity, namely by maintaining the stability of the coating viscosity so that it can produce resistors that meet specifications. From the data above, the production of resistors has been running stably with a period of 5 weeks, with 100 resistor samples being measured. With an average value of 2.82 mm. As for the Cpk value after implementing the new parameter setup, which is 3.35, this is a high result and meets the standard, which is ≥1.5.
Sistem Telemetri Akusisi Data Injeksi Plastik Menggunakan Xbee Pro S2C Irwanto Zarma Putra; Yopie Manurung; Illa Aryeni; Vivin Octowinandi; Erita Astrid; Citra Dewi; Ricky Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5312

Abstract

Plastic injection machine is a plastic product making machine with an injection molding process. Plastic injection machines at PT Shimano Batam currently cannot be monitored automatically. Therefore, a system is needed that monitors and stores all data about the performance of the plastic injection machine automatically. In this system Arduino Uno is used as a microcontroller of the plastic injection machine signal and the Xbee Pro S2C module is used as a sender and receiver of data packets from the plastic injection machine, the data is processed and then displayed on a PC and stored on the server. The test results of this system show that the machine status data matches the data displayed on the PC. From the results of testing the engine cycle time as much as 11 times, there is the largest difference in processing time, which is 1.20 seconds. From the results of reliability testing, packet loss was obtained by 0.006%. Xbee Pro S2C communication testing with a distance of 1 meter to 60 meters was successful without any data packets lost, when testing Xbee Pro S2C communication with a distance of 85 meters to 110 meters there were 30 data packets lost.
Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin Vivin Octowinandi; Fadli Firdaus; Ridwan Ridwan; Diono Diono; Rifqi Amalya F; Muhammad Naufal Airlangga Diputra; M Rif'an Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5492

Abstract

The PCB manufacturing process involves many processes, one of which is Surface finishes. One type of Surface finishes commonly used is Immersion tin. Immersion tin is a Surface finishes process that uses pure tin in the process. Immersion tin protects the copper from oxidation and makes the copper surface or pad easy to solder. The cleanliness of the pad and the thickness of the Immersion tin affect the quality of the PCB produced. Therefore, the researchers evaluated the quality of the results of the Immersion tin process using the DOE (Design of Experiment) method. Where this method can help in determining the optimal parameters. The variables used are Storage Time After Microetch and Immersion in tin Bath. In the research process it was found that PCBs underwent morphological changes at 23 hours after being stored in storage. This is caused by the presence of moisture that is still present on the PCB as a result of not being optimal during the drying process. In this study, the optimal Solder Coating Thickness in the 14th sample was 4.59 µm and with the parameters Storage Time After Microetch for 50 minutes and Immersion in tin Bath for 120 minutes. For the most optimal pad cleanliness found in the 5th and 12th samples with the Storage Time After Microetch parameter for 30 minutes and 60 minutes and marked by the absence of contaminants on the pad. In addition, in this study there were less than optimal mapping results marked by only 1 part of 1 sample containing tin from 16 test samples. The sample is the 3rd sample with the parameter Storage Time After Microetch for 10 minutes and Immersion in tin Bath for 55 minutes with a tin content of 91.9%.
Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME Octowinandi, Vivin; Risandriya, Sumantri K.; Asaad, Nur Sakinah; Diputra, Muhammad Naufal Airlangga; Ria, Riki; Pratama, Adjie Sukma; Wivanius, Nadhrah
Journal of Applied Electrical Engineering Vol. 8 No. 1 (2024): JAEE, June 2024
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v8i1.6991

Abstract

Saat ini PCB multi-layer banyak digunakan pada rangkaian elektronik karena mampu menyediakan PCB dengan kepadatan komponen yang lebih tinggi, kecepatan tinggi dan ukuran PCB yang relatif lebih kecil dibandingkan dengan PCB single layer. Untuk menjawab kebutuhan pasar, TFME (Teaching Factory Manucacturing of Electronics) yang merupakan salah satu laboratorium di lembaga Politeknik Batam, dirasa perlu melakukan penelitian untuk mengukur kemampuan produksi di bidang manufaktur PCB multi-layer, khususnya empat layer. Total PCB empat layer yang dibuat adalah sejumlah sembilan belas unit. Adapun metoda yang digunakan untuk mengukur kemampuan TFME dalam membuat PCB empat layer adalah dengan cara mengukur kesesuaian koneksi jalur tembaga terhadap desain dan pengecekan visual kesejajaran antar layer menggunakan mesin x-ray. Dari hasil pengujian dapat diketahui bahwa untuk PCB yang menggunakan via ukuran 0.7mm tidak memiliki cacat jalur putus.
Co-Authors Asaad, Nur Sakinah Citra Dewi Diono, Diono Erita Astrid Fadli Firdaus Illa Aryeni Irwanto Zarma Putra M Rif'an Maulana Maulidiah, Hana Mutialif Mochammad Imron Awalludin Muhammad Naufal Airlangga Diputra Nadhrah Wivanius, Nadhrah Pratama, Adjie Sukma Ria, Riki Ricky Maulana Ridwan Ridwan Rifqi Amalya F Risandriya, Sumantri K. Tamaulina Br Sembiring Yopie Manurung