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Journal : Mechatronics, Electrical Power, and Vehicular Technology

Mikrostruktur dan Karakterisasi Sifat Mekanik Lapisan Cr3C2-NiAl-Al2O3 Hasil Deposisi Dengan Menggunakan High Velocity Oxygen Fuel Thermal Spray Coating Riyanto, Edy; Prawara, Budi
Journal of Mechatronics, Electrical Power and Vehicular Technology Vol 1, No 1 (2010)
Publisher : Research Centre for Electrical Power and Mechatronics, Indonesian Istitutes of Sciences

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (149.664 KB) | DOI: 10.14203/j.mev.2010.v1.1-4

Abstract

Surface coating processing of industrial component with thermal spray coatings have been applied in many industrial fields. Ceramic matrix composite coating which consists of Cr3C2-Al2O3-NiAl had been carried out to obtain layers of material that has superior mechanical properties to enhance component performance. Deposition of CMC with High Velocity Oxygen Fuel (HVOF) thermal spray coating has been employed. This study aims to determine the effect of powder particle size on the microstructure, surface roughness and hardness of the layer, by varying the NiAl powder particle size. Test results show NiAl powder particle size has an influence on the mechanical properties of CMC coating. Hardness of coating increases and surface roughness values of coating decrease with smaller NiAl particle size.  
A Review of Atomic Layer Deposition for Nanoscale Devices Riyanto, Edy; Rijanto, Estiko; Prawara, Budi
Journal of Mechatronics, Electrical Power and Vehicular Technology Vol 3, No 2 (2012)
Publisher : Research Centre for Electrical Power and Mechatronics, Indonesian Istitutes of Sciences

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (334.963 KB) | DOI: 10.14203/j.mev.2012.v3.65-72

Abstract

Atomic layer deposition (ALD) is a thin film growth technique that utilizes alternating, self-saturation chemical reactions between gaseous precursors to achieve a deposited nanoscale layers. It has recently become a subject of great interest for ultrathin film deposition in many various applications such as microelectronics, photovoltaic, dynamic random access memory (DRAM), and microelectromechanic system (MEMS). By using ALD, the conformability and extreme uniformity of layers can be achieved in low temperature process. It facilitates to be deposited onto the surface in many variety substrates that have low melting temperature. Eventually it has advantages on the contribution to the wider nanodevices.